Datasheet MC74VHC04 (ON Semiconductor) - 4
| Manufacturer | ON Semiconductor |
| Description | Hex Inverter |
| Pages / Page | 7 / 4 — PACKAGE DIMENSIONS. SOIC−14 NB. SCALE 1:1. DETAIL A. MILLIMETERS. INCHES. … |
| Revision | 7 |
| File Format / Size | PDF / 245 Kb |
| Document Language | English |
PACKAGE DIMENSIONS. SOIC−14 NB. SCALE 1:1. DETAIL A. MILLIMETERS. INCHES. DIM. MIN. MAX. 13X b. X 45. C SEATING. PLANE. GENERIC
Model Line for this Datasheet
Text Version of Document
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOIC−14 NB
CASE 751A−03 14 ISSUE L 1 DATE 03 FEB 2016
SCALE 1:1 D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 14 8 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION
A3
SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.
E
4. DIMENSIONS D AND E DO NOT INCLUDE
H
MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER
L
SIDE. 1 7
DETAIL A MILLIMETERS INCHES
0.25
DIM MIN MAX MIN MAX
M B M
13X b A
1.35 1.75 0.054 0.068 0.25 M C A S B S
A1
0.10 0.25 0.004 0.010
A3
0.19 0.25 0.008 0.010
h DETAIL A b
0.35 0.49 0.014 0.019
A D
8.55 8.75 0.337 0.344
X 45
_
E
3.80 4.00 0.150 0.157
e
1.27 BSC 0.050 BSC
H
5.80 6.20 0.228 0.244
h
0.25 0.50 0.010 0.019 0.10
A1 M L
0.40 1.25 0.016 0.049
e M
0 _ 7 _ 0 _ 7 _
C SEATING PLANE GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
6.50 14X 14 1.18 XXXXXXXXXG 1 AWLYWW 1 XXXXX = Specific Device Code A = Assembly Location 1.27 WL = Wafer Lot PITCH Y = Year WW = Work Week G = Pb−Free Package 14X *This information is generic. Please refer to 0.58 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42565B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SOIC−14 NB PAGE 1 OF 2
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS SOIC−14 NB
CASE 751A−03 14 ISSUE L 1 DATE 03 FEB 2016
SCALE 1:1 D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 14 8 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION
A3
SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.
E
4. DIMENSIONS D AND E DO NOT INCLUDE
H
MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER
L
SIDE. 1 7
DETAIL A MILLIMETERS INCHES
0.25
DIM MIN MAX MIN MAX
M B M
13X b A
1.35 1.75 0.054 0.068 0.25 M C A S B S
A1
0.10 0.25 0.004 0.010
A3
0.19 0.25 0.008 0.010
h DETAIL A b
0.35 0.49 0.014 0.019
A D
8.55 8.75 0.337 0.344
X 45
_
E
3.80 4.00 0.150 0.157
e
1.27 BSC 0.050 BSC
H
5.80 6.20 0.228 0.244
h
0.25 0.50 0.010 0.019 0.10
A1 M L
0.40 1.25 0.016 0.049
e M
0 _ 7 _ 0 _ 7 _
C SEATING PLANE GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
6.50 14X 14 1.18 XXXXXXXXXG 1 AWLYWW 1 XXXXX = Specific Device Code A = Assembly Location 1.27 WL = Wafer Lot PITCH Y = Year WW = Work Week G = Pb−Free Package 14X *This information is generic. Please refer to 0.58 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42565B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SOIC−14 NB PAGE 1 OF 2
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
