Datasheet MBR640-MBR6200 (PanJit)

ManufacturerPanJit
DescriptionSCHOTTKY BARRIER RECTIFIERS
Pages / Page4 / 1 — MBR640~MBR6200. SCHOTTKY BARRIER RECTIFIERS. VOLTAGE 40 to 200 Volt …
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MBR640~MBR6200. SCHOTTKY BARRIER RECTIFIERS. VOLTAGE 40 to 200 Volt CURRENT 6 Ampere FEATURES

Datasheet MBR640-MBR6200 PanJit

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MBR640~MBR6200
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 40 to 200 Volt CURRENT 6 Ampere FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• For use in low voltage, high frequency inverters
free wheeling, and polarlity protection applications.
• Lead free in compliance with EU RoHS 2011/65/EU directive
• Green molding compound as per IEC61249 Std (Halogen Free) MECHANICAL DATA
• Case: TO-220AC molded plastic package
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Weight: 0.067 ounces, 1.89 grams. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Resistive or inductive load. PA RA M ETER SY M B O L M BR640 M aximum Re c ur r e nt Pea k Rever s e Volt a ge V RRM 40 45 M aximum RM S Volt a ge V RM S 28 M aximum DC B lo c k ing Volt a ge V DC 40 M aximum Ave r ag e Fo r w ar d Cur r ent I F( AV) 6 A Pea k Fo r w a r d S ur ge Cur r ent : 8. 3m ingle ha lf s ine-w a ve
s up er impo s ed on r at e d lo ad I F SM 75 A M aximum Fo r w ar d Volt ag e at 6A per le g VF M aximum DC Reve r s e Cur r e nt at Ra t e d DC B lo c k ing T J = 25 O C
T J = 100 O C
Volt a ge IR 0. 0 5
20 R θJ C 3 Ty pic al Ther mal Res is t anc e
O p er at ing J unc t ion and St or ag e Tempe r a t ur e Ra nge T J , T ST G 0. 7 -55 t o + 150 M BR660 M BR680 M BR690 M BR6 100 M BR6150 M BR6200 UNI TS 50 60 80 90 100 150 2 00 V 31.5 35 42 56 63 70 105 140 V 45 50 60 80 90 100 150 2 00 V M BR645 M BR650 0. 7 5 0.8 -65 t o + 1 75 0. 9 V
mA
O C / W
O C NOTES : Both Bonding and Chip structure are available. October 3,2016-REV.04 PAGE . 1