Datasheet MBRS130LT3G, SBRS8130LT3G, SBRS8130LN (ON Semiconductor)
| Manufacturer | ON Semiconductor |
| Description | Schottky Power Rectifier Surface Mount Power Package |
| Pages / Page | 6 / 1 — Surface Mount Power Package. www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. … |
| Revision | 11 |
| File Format / Size | PDF / 279 Kb |
| Document Language | English |
Surface Mount Power Package. www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 1.0 AMPERE. 30 VOLTS. Features. SMB. CASE 403A. MARKING DIAGRAM
Model Line for this Datasheet
Text Version of Document
Schottky Power Rectifier
Surface Mount Power Package
MBRS130LT3G, SBRS8130LT3G, SBRS8130LN This device employs the Schottky Barrier principle in a large area
www.onsemi.com
metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification,
SCHOTTKY BARRIER
or as free wheeling and polarity protection diodes, in surface mount
RECTIFIER
applications where compact size and weight are critical to the
1.0 AMPERE
system.
30 VOLTS Features
• Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25°C) • Small Compact Surface Mountable Package with J−Bend Leads • Highly Stable Oxide Passivated Junction • Guard−Ring for Stress Protection
SMB CASE 403A
• ESD Ratings: ♦ Human Body Model = 3B (> 16000 V)
MARKING DIAGRAM
♦ Machine Model = C (> 400 V) • SBRS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 AYWW 1BL3 Qualified and PPAP Capable* G G • These are Pb−Free Devices
Mechanical Characteristics
1BL3 = Specific Device Code • Case: Epoxy, Molded A = Assembly Location** Y = Year • Weight: 100 mg (approximately) WW = Work Week • Finish: All External Surfaces Corrosion Resistant and Terminal G = Pb−Free Package Leads are Readily Solderable (Note: Microdot may be in either location) • Lead and Mounting Surface Temperature for Soldering Purposes: **The Assembly Location code (A) is front side 260°C Max. for 10 Seconds optional. In cases where the Assembly Location is • stamped in the package bottom (molding ejecter pin), Cathode Polarity Band the front side assembly code may be blank.
ORDERING INFORMATION Device Package Shipping
† MBRS130LT3G SMB 2,500 / (Pb−Free) Tape & Reel SBRS8130LT3G* SMB 2,500 / (Pb−Free) Tape & Reel SBRS8130LT3G−VF01* SMB 2,500 / (Pb−Free) Tape & Reel SBRS8130LNT3G* SMB 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
December, 2019 − Rev. 11 MBRS130LT3/D
Surface Mount Power Package
MBRS130LT3G, SBRS8130LT3G, SBRS8130LN This device employs the Schottky Barrier principle in a large area
www.onsemi.com
metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification,
SCHOTTKY BARRIER
or as free wheeling and polarity protection diodes, in surface mount
RECTIFIER
applications where compact size and weight are critical to the
1.0 AMPERE
system.
30 VOLTS Features
• Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25°C) • Small Compact Surface Mountable Package with J−Bend Leads • Highly Stable Oxide Passivated Junction • Guard−Ring for Stress Protection
SMB CASE 403A
• ESD Ratings: ♦ Human Body Model = 3B (> 16000 V)
MARKING DIAGRAM
♦ Machine Model = C (> 400 V) • SBRS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 AYWW 1BL3 Qualified and PPAP Capable* G G • These are Pb−Free Devices
Mechanical Characteristics
1BL3 = Specific Device Code • Case: Epoxy, Molded A = Assembly Location** Y = Year • Weight: 100 mg (approximately) WW = Work Week • Finish: All External Surfaces Corrosion Resistant and Terminal G = Pb−Free Package Leads are Readily Solderable (Note: Microdot may be in either location) • Lead and Mounting Surface Temperature for Soldering Purposes: **The Assembly Location code (A) is front side 260°C Max. for 10 Seconds optional. In cases where the Assembly Location is • stamped in the package bottom (molding ejecter pin), Cathode Polarity Band the front side assembly code may be blank.
ORDERING INFORMATION Device Package Shipping
† MBRS130LT3G SMB 2,500 / (Pb−Free) Tape & Reel SBRS8130LT3G* SMB 2,500 / (Pb−Free) Tape & Reel SBRS8130LT3G−VF01* SMB 2,500 / (Pb−Free) Tape & Reel SBRS8130LNT3G* SMB 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
December, 2019 − Rev. 11 MBRS130LT3/D
