Datasheet BAV99 (Nexperia) - 7
| Manufacturer | Nexperia |
| Description | High-speed switching diode |
| Pages / Page | 10 / 7 — Nexperia. BAV99. High-speed switching diode. 13. Soldering. Fig. 8. … |
| Revision | 01072022 |
| File Format / Size | PDF / 203 Kb |
| Document Language | English |
Nexperia. BAV99. High-speed switching diode. 13. Soldering. Fig. 8. Reflow soldering footprint for SOT23
Model Line for this Datasheet
Text Version of Document
Nexperia BAV99 High-speed switching diode 13. Soldering
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 8. Reflow soldering footprint for SOT23
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig. 9. Wave soldering footprint for SOT23
BAV99 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet 1 July 2022 7 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 8. Reflow soldering footprint for SOT23
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig. 9. Wave soldering footprint for SOT23
BAV99 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet 1 July 2022 7 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
