Datasheet TDA6107AJF (Philips) - 8
| Manufacturer | Philips |
| Description | Triple Video Output Amplifier |
| Pages / Page | 16 / 8 — Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Fig 7 |
| File Format / Size | PDF / 97 Kb |
| Document Language | English |
Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Fig 7
Model Line for this Datasheet
Text Version of Document
Philips Semiconductors TDA6107AJF Triple video output amplifier
2.96 Vi (V) 2.34 t 1.73 tst Ov (in %) 151 150 140 149 Voc (V) 100 60 50 t toc(r) tco(p) mce477
Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal
9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 8 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents
2.96 Vi (V) 2.34 t 1.73 tst Ov (in %) 151 150 140 149 Voc (V) 100 60 50 t toc(r) tco(p) mce477
Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal
9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 8 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents
