MAX6070/MAX6071 Low-Noise, High-Precision Series Voltage References Absolute Maximum Ratings OUTF to GNDS, GNDF, GND .. -0.3V to the lower of Continuous Power Dissipation (TA = +70°C) (VIN + 0.3V), +6V SOT23 (derate 4.3mW/NC above +70°C) ... 347.8mW OUTS to GNDS, GNDF, GND ...-0.3V to +6V WLP (derate 10.2mW/NC above 70°C ..816mW IN to GNDS, GNDF, GND ...-0.3V to +6V Operating Temperature Range ... -40°C to +125°C EN to GNDS, GNDF, GND ..-0.3V to +6V Junction Temperature ..+150°C FILTER to GND .. -0.3V to the lower of Storage Temperature Range .. -65°C to +150°C (VIN + 0.3V), +6V Soldering Temperature (reflow) ...+260°C GNDS to GNDF ..-0.3V to +0.3V Lead Temperature (soldering, 10s) ...+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information6 SOT23PACKAGE CODEU6+5/U6+5A Outline Number 21-0058 Land Pattern Number 90-0175Thermal Resistance, Multi-Layer Board: Junction to Ambient (θJA) 230°C/W Junction to Case (θJC) 76°C/W 6 Thin WLPPACKAGE CODEN60B1+1 Outline Number 21-0744 Land Pattern Number Refer to Application Note 1891Thermal Resistance, Multi-Layer Board: Junction to Ambient (θJA) 98°C/W For the latest package outline information and land patterns (footprints), go to www.analog.com/packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.analog.com/thermal-tutorial . www.analog.com Analog Devices │ 2