Datasheet REF20-Q1 (Texas Instruments) - 5

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REF20-Q1 www.ti.com
SBOSA80 – DECEMBER 2021
7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VIN –0.3 6 Input voltage V EN –0.3 VIN + 0.3 Operating –55 150 Temperature Junction, Tj 150 °C Storage, Tstg –65 170 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per AEC Q100-002 (1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±1500 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Supply input voltage range (IL = 0 mA, TA = 25°C) VREF + 0.02 (1) 5.5 V (1) See Figure 7-27 in Section 7.6 for minimum input voltage at different load currents and temperature
7.4 Thermal Information REF20xx-Q1 THERMAL METRIC
(1)
DDC (SOT23) UNIT 5 PINS
RθJA Junction-to-ambient thermal resistance 193.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 40.2 °C/W RθJB Junction-to-board thermal resistance 34.5 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 34.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: REF20-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Typical Characteristics 8 Parameter Measurement Information 8.1 Solder Heat Shift 8.2 Long-Term Stability 8.3 Thermal Hysteresis 8.4 Noise Performance 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 VREF and VBIAS Tracking 9.3.2 Low Temperature Drift 9.3.3 Load Current 9.4 Device Functional Modes 10 Applications and Implementation 10.1 Application Information 10.2 Typical Application 10.2.1 Low-Side, Current-Sensing Application 10.2.1.1 Design Requirements 10.2.1.2 Detailed Design Procedure 10.2.1.2.1 Shunt Resistor 10.2.1.2.2 Differential Amplifier 10.2.1.2.3 Voltage Reference 10.2.1.2.4 Error Calculations 10.2.1.2.5 Application Curves 11 Power-Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Receiving Notification of Documentation Updates 13.3 Support Resources 13.4 Trademarks 13.5 Electrostatic Discharge Caution 13.6 Glossary 14 Mechanical, Packaging, and Orderable Information