Datasheet NCL30000 (ON Semiconductor) - 5
| Manufacturer | ON Semiconductor |
| Description | LED Driver, Dimmable, Power Factor Corrected |
| Pages / Page | 25 / 5 — NCL30000. Overview. Table 2. MAXIMUM RATINGS. Rating. Symbol. Value. … |
| File Format / Size | PDF / 394 Kb |
| Document Language | English |
NCL30000. Overview. Table 2. MAXIMUM RATINGS. Rating. Symbol. Value. Unit. http://onsemi.com
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NCL30000 Overview
Figure 2 illustrates how the NCL30000 is configured to the power switch is on for the same length of time over a half implement an isolated power factor corrected flyback cycle of input power. The current in the primary of the switch mode power supply. On the secondary side is the transformer starts at zero each switching cycle and is directly NCS1002, a constant voltage, constant current controller proportional to the applied voltage times the on-time. which senses the average LED current and the output Therefore with a fixed on-time, the current will follow the voltage and provides a feedback control signal to the applied voltage generating a current of the same shape. Just primary side through an opto-coupler interface. One of the as in a traditional boost PFC circuit, the control bandwidth key benefits of active power factor correction is that it makes is low so that the on-time is constant throughout a single line the load appear like a linear resistance similar to an cycle. The feedback signal from the secondary side is used incandescent bulb. High power factor requires generally to modify the average on-time so the current through the sinusoidal line current and minimal phase displacement LEDs is properly regulated regardless of forward voltage between the line current and voltage. The NCL30000 variation of the LED string. operates in a fixed on-time variable frequency mode where
Table 2. MAXIMUM RATINGS Rating Symbol Value Unit
MFP Voltage VMFP −0.3 to 10 V MFP Current IMFP 10 mA COMP Voltage VControl −0.3 to 6.5 V COMP Current IControl −2 to 10 mA Ct Voltage VCt −0.3 to 6 V Ct Current ICt 10 mA CS Voltage VCS −0.3 to 6 V CS Current ICS 10 mA ZCD Voltage VZCD −0.3 to 10 V ZCD Current IZCD 10 mA DRV Voltage VDRV −0.3 to VCC V DRV Sink Current IDRV(sink) 800 mA DRV Source Current IDRV(source) 500 mA Supply Voltage VCC −0.3 to 20 V Supply Current ICC 20 mA Power Dissipation (TA = 70C, 2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad) PD 450 mW Thermal Resistance Junction-to-Ambient C/W (2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad) RqJA 178 Junction-to-Air, Low conductivity PCB (Note 3) RqJA 168 Junction-to-Air, High conductivity PCB (Note 4) RqJA 127 Operating Junction Temperature Range TJ −40 to 125 C Maximum Junction Temperature TJ(MAX) 150 C Storage Temperature Range TSTG −65 to 150 C Lead Temperature (Soldering, 10 s) TL 300 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Pins 1–8: Human Body Model 2000 V per JEDEC Standard JESD22−A114E. Pins 1– 8:Machine Model Method 200 V per JEDEC Standard JESD22−A115−A. 2. This device contains Latch-up protection and exceeds 100 mA per JEDEC Standard JESD78. 3. As mounted on a 40 40 1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 40 40 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.
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NCL30000 Overview
Figure 2 illustrates how the NCL30000 is configured to the power switch is on for the same length of time over a half implement an isolated power factor corrected flyback cycle of input power. The current in the primary of the switch mode power supply. On the secondary side is the transformer starts at zero each switching cycle and is directly NCS1002, a constant voltage, constant current controller proportional to the applied voltage times the on-time. which senses the average LED current and the output Therefore with a fixed on-time, the current will follow the voltage and provides a feedback control signal to the applied voltage generating a current of the same shape. Just primary side through an opto-coupler interface. One of the as in a traditional boost PFC circuit, the control bandwidth key benefits of active power factor correction is that it makes is low so that the on-time is constant throughout a single line the load appear like a linear resistance similar to an cycle. The feedback signal from the secondary side is used incandescent bulb. High power factor requires generally to modify the average on-time so the current through the sinusoidal line current and minimal phase displacement LEDs is properly regulated regardless of forward voltage between the line current and voltage. The NCL30000 variation of the LED string. operates in a fixed on-time variable frequency mode where
Table 2. MAXIMUM RATINGS Rating Symbol Value Unit
MFP Voltage VMFP −0.3 to 10 V MFP Current IMFP 10 mA COMP Voltage VControl −0.3 to 6.5 V COMP Current IControl −2 to 10 mA Ct Voltage VCt −0.3 to 6 V Ct Current ICt 10 mA CS Voltage VCS −0.3 to 6 V CS Current ICS 10 mA ZCD Voltage VZCD −0.3 to 10 V ZCD Current IZCD 10 mA DRV Voltage VDRV −0.3 to VCC V DRV Sink Current IDRV(sink) 800 mA DRV Source Current IDRV(source) 500 mA Supply Voltage VCC −0.3 to 20 V Supply Current ICC 20 mA Power Dissipation (TA = 70C, 2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad) PD 450 mW Thermal Resistance Junction-to-Ambient C/W (2.0 Oz Cu, 55 mm2 Printed Circuit Copper Clad) RqJA 178 Junction-to-Air, Low conductivity PCB (Note 3) RqJA 168 Junction-to-Air, High conductivity PCB (Note 4) RqJA 127 Operating Junction Temperature Range TJ −40 to 125 C Maximum Junction Temperature TJ(MAX) 150 C Storage Temperature Range TSTG −65 to 150 C Lead Temperature (Soldering, 10 s) TL 300 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Pins 1–8: Human Body Model 2000 V per JEDEC Standard JESD22−A114E. Pins 1– 8:Machine Model Method 200 V per JEDEC Standard JESD22−A115−A. 2. This device contains Latch-up protection and exceeds 100 mA per JEDEC Standard JESD78. 3. As mounted on a 40 40 1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 40 40 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.
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