EPC2103 – Enhancement-Mode GaN Power Transistor Half BridgePreliminary Specification SheetFeatures: • Greater than 97% System Efficiency at 20 A o 48 VIN to 12 VOUT, 500 kHz o Includes driver, inductor, and output filter • High Frequency Operation • High Density Footprint EPC2103 devices are supplied only in • Low Inductance Package passivated die form with solder balls • Pb-Free (RoHS Compliant), Halogen Free Die Size: 6.05 mm x 2.3 mm Applications: • High Frequency DC-DC Conversion Typical System Efficiency98.598Typical Circuit97.5)97(% y c 96.5n e ci96Effif95.5sw=300 kHzfsw=500 kHz9594.59402468101214161820222426Output Current (A)VIN = 48 V, VOUT = 12 VMAXIMUM RATINGSParameterValue Maximum Drain – Source Voltage (VSW to PGND, VIN to VSW) 80 V Maximum Gate – Source Voltage Range (Gate 1 to VSW, Gate 2 to PGND) -4 V < VGS < 6 V Q1 Control FET 23 A Continuous Drain Current, 25 °C, RθJA = 22 (Q1), 22 (Q2) Q2 Sync FET 23 A Q1 Control FET 195 A Maximum Pulsed Drain Current, 25 °C, Tpulse = 300 µs Q2 Sync FET 195 A Optimum Temperature Range -40 °C < TJ < 150 °C Subject to Change without Notice www.epc-co.com COPYRIGHT 2015 Page 1