Datasheet MCP6561, MCP6561R, MCP6561U, MCP6562, MCP6564 (Microchip) - 5
| Manufacturer | Microchip |
| Description | 1.8V Low-Power Push-Pull Output Comparator |
| Pages / Page | 46 / 5 — MCP6561/1R/1U/2/4. 2.0. TYPICAL PERFORMANCE CURVES. Note:. 50%. 30%. DD = … |
| File Format / Size | PDF / 1.2 Mb |
| Document Language | English |
MCP6561/1R/1U/2/4. 2.0. TYPICAL PERFORMANCE CURVES. Note:. 50%. 30%. DD = 1.8V. DD = 5.5V. 25%. Avg. = 3.4 mV. Avg. = 3.6 mV. 40%. CM = VSS
Model Line for this Datasheet
Text Version of Document
MCP6561/1R/1U/2/4 2.0 TYPICAL PERFORMANCE CURVES Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND, RL = 10 k to VDD/2, and CL = 25 pF.
50% 30% V V V V DD = 1.8V DD = 5.5V DD = 1.8V DD = 5.5V 25% Avg. = 3.4 mV Avg. = 3.6 mV ) V V 40% CM = VSS CM = VSS ) StDev = 0.2 mV StDev = 0.1 mV % Avg. = -0.1 mV Avg. = -0.9 mV % ( 3588 units 3588 units StDev = 2.1 mV 20% s StDev = 2.1 mV e 30% 3588 units 3588 units c ces ( n 15% en rr 20% rre cu 10% c ccu O 10% O 5% 0% 0% -10 -8 -6 -4 -2 0 2 4 6 8 10 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VOS (mV) VHYST (mV) FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Hysteresis Voltage.
60% 60% VCM = VSS V 50% V DD = 1.8V ) Avg. = 0.9 µV/°C 50% ) DD = 5.5V Avg. = 12 µV/°C % StDev = 6.6 µV/°C % Avg. = 10.4 µV/°C ( StDev = 0.6 µV/°C 40% 1380 Units ( StDev = 0.6 µV/°C s 40% s e T e c A = -40°C to +125°C c 30% en 30% en rr rr cu 20% cu 20% c c O O 1380 Units 10% 10% TA = -40°C to 125°C VCM = VSS 0% 0% -60 -48 -36 -24 -12 0 12 24 36 48 60 0 2 4 6 8 10 12 14 16 18 20 VOS Drift (µV/°C) VHYST Drift, TC1 (µV/°C) FIGURE 2-2:
Input Offset Voltage Drift.
FIGURE 2-5:
Input Hysteresis Voltage Drift - Linear Temp. Co. (TC1).
7.0 V 30% DD = 5.5V VIN+ = VDD/2 6.0 ) VDD = 5.5V VDD = 1.8V 5.0 % ( Avg. = 0.25 µV/°C2 Avg. = 0.3 µV/°C2 V 20% s 4.0 IN- VOUT e StDev = 0.1 µV/°C2 StDev = 0.2 µV/°C2 c (V) T 3.0 en OU rr V 1380 Units 2.0 cu 10% c TA = -40°C to +125°C 1.0 O VCM = VSS 0.0 0% -1.0 -0.50 -0.25 0.00 0.25 0.50 0.75 1.00 Time (3 µs/div) VHYST Drift, TC2 (µV/°C2) FIGURE 2-3:
Input vs. Output Signal, No
FIGURE 2-6:
Input Hysteresis Voltage Phase Reversal. Drift - Quadratic Temp. Co. (TC2). 2009-2013 Microchip Technology Inc. DS22139C-page 5 Document Outline MCP6561/1R/1U/2/4 1.0 Electrical Characteristics 1.1 Maximum Ratings 1.2 Test Circuit Configuration FIGURE 1-1: AC and DC Test Circuit for the Push-Pull Output Comparators. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input vs. Output Signal, No Phase Reversal. FIGURE 2-4: Input Hysteresis Voltage. FIGURE 2-5: Input Hysteresis Voltage Drift - Linear Temp. Co. (TC1). FIGURE 2-6: Input Hysteresis Voltage Drift - Quadratic Temp. Co. (TC2). FIGURE 2-7: Input Offset Voltage vs. Temperature. FIGURE 2-8: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-9: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-10: Input Hysteresis Voltage vs. Temperature. FIGURE 2-11: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-12: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-13: Input Offset Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-14: Quiescent Current. FIGURE 2-15: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-16: Input Hysteresis Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-17: Quiescent Current vs. Supply Voltage vs Temperature. FIGURE 2-18: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-19: Quiescent Current vs. Toggle Frequency. FIGURE 2-20: Output Headroom vs. Output Current. FIGURE 2-21: Low-to-High and High-to- Low Propagation Delays. FIGURE 2-22: Short Circuit Current vs. Supply Voltage vs. Temperature. FIGURE 2-23: Output Headroom vs.Output Current. FIGURE 2-24: Low-to-High and High-to- Low Propagation Delays . FIGURE 2-25: Propagation Delay Skew. FIGURE 2-26: Propagation Delay vs. Supply Voltage. FIGURE 2-27: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-28: Propagation Delay vs. Temperature. FIGURE 2-29: Propagation Delay vs. Input Over-Drive. FIGURE 2-30: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-31: Propagation Delay vs. Capacitive Load. FIGURE 2-32: Input Bias Current vs. Input Voltage vs Temperature. FIGURE 2-33: Common-mode Rejection Ratio and Power Supply Rejection Ratio vs. Temperature. FIGURE 2-34: Power Supply Rejection Ratio (PSRR). FIGURE 2-35: Common-mode Rejection Ratio (CMRR). FIGURE 2-36: Common-mode Rejection Ratio (CMRR). FIGURE 2-37: Output Jitter vs. Input Frequency. FIGURE 2-38: Input Offset Current and Input Bias Current vs. Temperature. FIGURE 2-39: Input Offset Current and Input Bias Current vs. Common-mode Input Voltage vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs 3.2 Digital Outputs 3.3 Power Supply (VSS and VDD) 4.0 Applications Information 4.1 Comparator Inputs 4.1.1 Normal Operation FIGURE 4-1: The MCP6561/1R/1U/2/4 Comparators’ Internal Hysteresis Eliminates Output Chatter Caused by Input Noise Voltage. 4.1.2 Input Voltage and Current Limits FIGURE 4-2: Simplified Analog Input ESD Structures. FIGURE 4-3: Protecting the Analog Inputs. 4.1.3 Phase Reversal 4.2 Push-Pull Output 4.3 Externally Set Hysteresis 4.3.1 Non-Inverting Circuit FIGURE 4-4: Non-inverting Circuit with Hysteresis for Single-Supply. FIGURE 4-5: Hysteresis Diagram for the Non-inverting Circuit. 4.3.2 Inverting Circuit FIGURE 4-6: Inverting Circuit With Hysteresis. FIGURE 4-7: Hysteresis Diagram for the Inverting Circuit. FIGURE 4-8: Thevenin Equivalent Circuit. 4.4 Bypass Capacitors 4.5 Capacitive Loads 4.6 PCB Surface Leakage FIGURE 4-9: Example Guard Ring Layout for Inverting Circuit. 4.7 PCB Layout Technique FIGURE 4-10: Recommended Layout. 4.8 Unused Comparators FIGURE 4-11: Unused Comparators. 4.9 Typical Applications 4.9.1 Precise Comparator FIGURE 4-12: Precise Inverting Comparator. 4.9.2 Windowed Comparator FIGURE 4-13: Windowed Comparator. 4.9.3 Bistable Multivibrator FIGURE 4-14: Bistable Multivibrator. 5.0 Design Aids 5.1 Microchip Advanced Part Selector (MAPS) 5.2 Analog Demonstration and Evaluation Boards 5.3 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND, RL = 10 k to VDD/2, and CL = 25 pF.
50% 30% V V V V DD = 1.8V DD = 5.5V DD = 1.8V DD = 5.5V 25% Avg. = 3.4 mV Avg. = 3.6 mV ) V V 40% CM = VSS CM = VSS ) StDev = 0.2 mV StDev = 0.1 mV % Avg. = -0.1 mV Avg. = -0.9 mV % ( 3588 units 3588 units StDev = 2.1 mV 20% s StDev = 2.1 mV e 30% 3588 units 3588 units c ces ( n 15% en rr 20% rre cu 10% c ccu O 10% O 5% 0% 0% -10 -8 -6 -4 -2 0 2 4 6 8 10 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VOS (mV) VHYST (mV) FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Hysteresis Voltage.
60% 60% VCM = VSS V 50% V DD = 1.8V ) Avg. = 0.9 µV/°C 50% ) DD = 5.5V Avg. = 12 µV/°C % StDev = 6.6 µV/°C % Avg. = 10.4 µV/°C ( StDev = 0.6 µV/°C 40% 1380 Units ( StDev = 0.6 µV/°C s 40% s e T e c A = -40°C to +125°C c 30% en 30% en rr rr cu 20% cu 20% c c O O 1380 Units 10% 10% TA = -40°C to 125°C VCM = VSS 0% 0% -60 -48 -36 -24 -12 0 12 24 36 48 60 0 2 4 6 8 10 12 14 16 18 20 VOS Drift (µV/°C) VHYST Drift, TC1 (µV/°C) FIGURE 2-2:
Input Offset Voltage Drift.
FIGURE 2-5:
Input Hysteresis Voltage Drift - Linear Temp. Co. (TC1).
7.0 V 30% DD = 5.5V VIN+ = VDD/2 6.0 ) VDD = 5.5V VDD = 1.8V 5.0 % ( Avg. = 0.25 µV/°C2 Avg. = 0.3 µV/°C2 V 20% s 4.0 IN- VOUT e StDev = 0.1 µV/°C2 StDev = 0.2 µV/°C2 c (V) T 3.0 en OU rr V 1380 Units 2.0 cu 10% c TA = -40°C to +125°C 1.0 O VCM = VSS 0.0 0% -1.0 -0.50 -0.25 0.00 0.25 0.50 0.75 1.00 Time (3 µs/div) VHYST Drift, TC2 (µV/°C2) FIGURE 2-3:
Input vs. Output Signal, No
FIGURE 2-6:
Input Hysteresis Voltage Phase Reversal. Drift - Quadratic Temp. Co. (TC2). 2009-2013 Microchip Technology Inc. DS22139C-page 5 Document Outline MCP6561/1R/1U/2/4 1.0 Electrical Characteristics 1.1 Maximum Ratings 1.2 Test Circuit Configuration FIGURE 1-1: AC and DC Test Circuit for the Push-Pull Output Comparators. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input vs. Output Signal, No Phase Reversal. FIGURE 2-4: Input Hysteresis Voltage. FIGURE 2-5: Input Hysteresis Voltage Drift - Linear Temp. Co. (TC1). FIGURE 2-6: Input Hysteresis Voltage Drift - Quadratic Temp. Co. (TC2). FIGURE 2-7: Input Offset Voltage vs. Temperature. FIGURE 2-8: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-9: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-10: Input Hysteresis Voltage vs. Temperature. FIGURE 2-11: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-12: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-13: Input Offset Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-14: Quiescent Current. FIGURE 2-15: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-16: Input Hysteresis Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-17: Quiescent Current vs. Supply Voltage vs Temperature. FIGURE 2-18: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-19: Quiescent Current vs. Toggle Frequency. FIGURE 2-20: Output Headroom vs. Output Current. FIGURE 2-21: Low-to-High and High-to- Low Propagation Delays. FIGURE 2-22: Short Circuit Current vs. Supply Voltage vs. Temperature. FIGURE 2-23: Output Headroom vs.Output Current. FIGURE 2-24: Low-to-High and High-to- Low Propagation Delays . FIGURE 2-25: Propagation Delay Skew. FIGURE 2-26: Propagation Delay vs. Supply Voltage. FIGURE 2-27: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-28: Propagation Delay vs. Temperature. FIGURE 2-29: Propagation Delay vs. Input Over-Drive. FIGURE 2-30: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-31: Propagation Delay vs. Capacitive Load. FIGURE 2-32: Input Bias Current vs. Input Voltage vs Temperature. FIGURE 2-33: Common-mode Rejection Ratio and Power Supply Rejection Ratio vs. Temperature. FIGURE 2-34: Power Supply Rejection Ratio (PSRR). FIGURE 2-35: Common-mode Rejection Ratio (CMRR). FIGURE 2-36: Common-mode Rejection Ratio (CMRR). FIGURE 2-37: Output Jitter vs. Input Frequency. FIGURE 2-38: Input Offset Current and Input Bias Current vs. Temperature. FIGURE 2-39: Input Offset Current and Input Bias Current vs. Common-mode Input Voltage vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs 3.2 Digital Outputs 3.3 Power Supply (VSS and VDD) 4.0 Applications Information 4.1 Comparator Inputs 4.1.1 Normal Operation FIGURE 4-1: The MCP6561/1R/1U/2/4 Comparators’ Internal Hysteresis Eliminates Output Chatter Caused by Input Noise Voltage. 4.1.2 Input Voltage and Current Limits FIGURE 4-2: Simplified Analog Input ESD Structures. FIGURE 4-3: Protecting the Analog Inputs. 4.1.3 Phase Reversal 4.2 Push-Pull Output 4.3 Externally Set Hysteresis 4.3.1 Non-Inverting Circuit FIGURE 4-4: Non-inverting Circuit with Hysteresis for Single-Supply. FIGURE 4-5: Hysteresis Diagram for the Non-inverting Circuit. 4.3.2 Inverting Circuit FIGURE 4-6: Inverting Circuit With Hysteresis. FIGURE 4-7: Hysteresis Diagram for the Inverting Circuit. FIGURE 4-8: Thevenin Equivalent Circuit. 4.4 Bypass Capacitors 4.5 Capacitive Loads 4.6 PCB Surface Leakage FIGURE 4-9: Example Guard Ring Layout for Inverting Circuit. 4.7 PCB Layout Technique FIGURE 4-10: Recommended Layout. 4.8 Unused Comparators FIGURE 4-11: Unused Comparators. 4.9 Typical Applications 4.9.1 Precise Comparator FIGURE 4-12: Precise Inverting Comparator. 4.9.2 Windowed Comparator FIGURE 4-13: Windowed Comparator. 4.9.3 Bistable Multivibrator FIGURE 4-14: Bistable Multivibrator. 5.0 Design Aids 5.1 Microchip Advanced Part Selector (MAPS) 5.2 Analog Demonstration and Evaluation Boards 5.3 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
