Datasheet TLC2272, TLC2272A, TLC2272M, TLC2272AM, TLC2274, TLC2274A, TLC2274M, TLC2274AM (Texas Instruments) - 6

TLC2272 , TLC2272A , TLC2272M , TLC2272AM TLC2274 , TLC2274A , TLC2274M , TLC2274AM
SLOS190H – FEBRUARY 1997 – REVISED MARCH 2016
www.ti.com Recommended Operating Conditions (continued) MIN MAX UNIT
C LEVEL PARTS 0 70 I LEVEL PARTS –40 125 TA Operating free-air temperature °C Q LEVEL PARTS –40 125 M LEVEL PARTS –55 125
6.4 Thermal Information TLC2272 TLC2274 D P PW FK U D N PW FK J THERMAL METRIC(1) UNIT (SOIC) (PDIP) (TSSOP) (LCCC) (CFP) (SOIC) (PDIP) (TSSOP) (LCCC) (CDIP) 8-PIN 8-PIN 8-PIN 20-PIN 10-PIN 14-PIN 14-PIN 14-PIN 20-PIN 14-PIN
Junction-to-ambient thermal RθJA resistance (2)(3) 115.6 58.5 175.8 — — 83.8 — 111.6 — — °C/W Junction-to-case (top) thermal RθJC(top) resistance (2)(3) 61.8 48.3 58.8 18 121.3 43.2 34 41.2 16 16.2 °C/W Junction-to-board thermal RθJB 55.9 35.6 104.3 — — 38.4 — 54.7 — — °C/W resistance Junction-to-top ψJT 14.3 25.9 5.9 — — 9.4 — 3.9 — — °C/W characterization parameter Junction-to-board ψJB 55.4 35.5 102.6 — — 38.1 — 53.9 — — °C/W characterization parameter Junction-to-case (bottom) RθJC(bot) — — — — 8.68 — — — — — °C/W thermal resistance (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (3) The package thermal impedance is calculated in accordance with JESD 51-7 (plastic) or MIL-STD-883 Method 1012 (ceramic).
6.5 TLC2272 and TLC2272A Electrical Characteristics VDD = 5 V
at specified free-air temperature, VDD = 5 V; TA = 25°C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TLC2272 300 2500 TA = 25°C V TLC2272A 300 950 V IC = 0 V, VDD± = ±2.5 V, IO Input offset voltage µV VO = 0 V, RS = 50 Ω TLC2272 3000 Full Range(1) TLC2272A 1500 Temperature coefficient of αVIO V input offset voltage IC = 0 V, VDD± = ±2.5 V, VO = 0 V, RS = 50 Ω 2 μV/°C Input offset voltage long-term drift(2) VIC = 0 V, VDD± = ±2.5 V, VO = 0 V, RS = 50 Ω 0.002 μV/mo All level parts TA = 25°C 0.5 60 C level part TA = 0°C to 80°C 100 V I IC = 0 V, VDD± = ±2.5 V, IO Input offset current I level part T pA V A = –40°C to 85°C 150 O = 0 V, RS = 50 Ω Q level part TA = –40°C to 125°C 800 M level part TA = –55°C to 125°C 800 All level parts TA = 25°C 1 60 C level part TA = 0°C to 80°C 100 V I IC = 0 V, VDD± = ±2.5 V, IB Input bias current I level part T pA V A = –40°C to 85°C 150 O = 0 V, RS = 50 Ω Q level part TA = –40°C to 125°C 800 M level part TA = –55°C to 125°C 800 TA = 25°C –0.3 2.5 4 VICR Common-mode input voltage RS = 50 Ω; |VIO | ≤ 5 mV V Full Range(1) 0 2.5 3.5 (1) TA = –55°C to 125°C. (2) Typical values are based on the input offset voltage shift observed through 168 hours of operating life test at TA = 150°C extrapolated to TA = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV. 6 Submit Documentation Feedback Copyright © 1997–2016, Texas Instruments Incorporated Product Folder Links: TLC2272 TLC2272A TLC2272M TLC2272AM TLC2274 TLC2274A TLC2274M TLC2274AM Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 TLC2272 and TLC2272A Electrical Characteristics VDD = 5 V 6.6 TLC2272 and TLC2272A Electrical Characteristics VDD± = ±5 V 6.7 TLC2274 and TLC2274A Electrical Characteristics VDD = 5 V 6.8 TLC2274 and TLC2274A Electrical Characteristics VDD± = ±5 V 6.9 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.1.1 Macromodel Information 8.2 Typical Application 8.2.1 High-Side Current Monitor 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Related Links 11.2 Community Resources 11.3 Trademarks 11.4 Electrostatic Discharge Caution 11.5 Glossary 12 Mechanical, Packaging, and Orderable Information