Datasheet TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375 (Texas Instruments) - 9
| Manufacturer | Texas Instruments |
| Description | TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown |
| Pages / Page | 59 / 9 — TLV2370,. TLV2371. , TLV2372. TLV2373,. TLV2374. , TLV2375. www.ti.com. … |
| Revision | F |
| File Format / Size | PDF / 2.4 Mb |
| Document Language | English |
TLV2370,. TLV2371. , TLV2372. TLV2373,. TLV2374. , TLV2375. www.ti.com. 7.3 Thermal Information: TLV2370. TLV2370. THERMAL METRIC(1)
Text Version of Document
TLV2370, TLV2371 , TLV2372 TLV2373, TLV2374 , TLV2375 www.ti.com
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
7.3 Thermal Information: TLV2370 TLV2370 THERMAL METRIC(1) DBV (SOT-23) D (SOIC) P (PDIP) UNIT 6 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 228.5 138.4 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.1 89.5 39.4 °C/W RθJB Junction-to-board thermal resistance 54.6 78.6 26.4 °C/W ψJT Junction-to-top characterization parameter 7.7 29.9 15.4 °C/W ψJB Junction-to-board characterization parameter 53.8 78.1 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.4 Thermal Information: TLV2371 TLV2371 THERMAL METRIC(1) DBV (SOT-23) D (SOIC) P (PDIP) UNIT 5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 228.5 138.4 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.1 89.5 39.4 °C/W RθJB Junction-to-board thermal resistance 54.6 78.6 26.4 °C/W ψJT Junction-to-top characterization parameter 7.7 29.9 15.4 °C/W ψJB Junction-to-board characterization parameter 53.8 78.1 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.5 Thermal Information: TLV2372 TLV2372 THERMAL METRIC(1) D (SOIC) DGK (VSSOP) P (PDIP) UNIT 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 138.4 191.2 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 89.5 61.9 39.4 °C/W RθJB Junction-to-board thermal resistance 78.6 111.9 26.4 °C/W ψJT Junction-to-top characterization parameter 29.9 5.1 15.4 °C/W ψJB Junction-to-board characterization parameter 78.1 110.2 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2001–2016, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
7.3 Thermal Information: TLV2370 TLV2370 THERMAL METRIC(1) DBV (SOT-23) D (SOIC) P (PDIP) UNIT 6 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 228.5 138.4 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.1 89.5 39.4 °C/W RθJB Junction-to-board thermal resistance 54.6 78.6 26.4 °C/W ψJT Junction-to-top characterization parameter 7.7 29.9 15.4 °C/W ψJB Junction-to-board characterization parameter 53.8 78.1 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.4 Thermal Information: TLV2371 TLV2371 THERMAL METRIC(1) DBV (SOT-23) D (SOIC) P (PDIP) UNIT 5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 228.5 138.4 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.1 89.5 39.4 °C/W RθJB Junction-to-board thermal resistance 54.6 78.6 26.4 °C/W ψJT Junction-to-top characterization parameter 7.7 29.9 15.4 °C/W ψJB Junction-to-board characterization parameter 53.8 78.1 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.5 Thermal Information: TLV2372 TLV2372 THERMAL METRIC(1) D (SOIC) DGK (VSSOP) P (PDIP) UNIT 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 138.4 191.2 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 89.5 61.9 39.4 °C/W RθJB Junction-to-board thermal resistance 78.6 111.9 26.4 °C/W ψJT Junction-to-top characterization parameter 29.9 5.1 15.4 °C/W ψJB Junction-to-board characterization parameter 78.1 110.2 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2001–2016, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information
