Evaluation Module Texas Instruments TMP007EVM

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Detailed Description

The integrated thermopile absorbs the infrared energy emitted from the object which appears in the sensor’s field of view. The thermopile voltage is digitized and provided as an input to the integrated math processor, along with the local die temperature. The processor then computes the corresponding object temperature. Default Seebeck coefficient and thermal transient coefficients are encoded into the processor. System calibration values can be programmed and stored in the built-in non-volatile memory as user-inputs for improved accuracy. An alert function is available and can be programmed in comparator or interrupt mode.

The TMP007EVM consists of two PCBs; the SM-USB-DIG which communicates with the computer, provides power, and sends and receives appropriate digital signals. The second board is the TMP007 Test Board, which contains the TMP007 and its support circuitry.

Features

• Small form Factor
• Easy to use graphical user interface (GUI)
• Protective plastic Case
• TMP007 Features
  • Thermopile and Local Die Temperature Sensor
    • NETD: 90 mK
    • Responsivity: 9 V/W
    • Sensor Noise: 300 nVrms
  • Integrated Math Engine
    • 14-Bit (0.03125°C) Resolution
    • Alert Pin: Interrupt and Comparator Modes
    • Nonvolatile Memory
    • Programmable Conversion Rate
    • Transient Correction
    • Low Quiescent Current: 270-µA Active, 2-µA Shutdown
• I²C and SMBus Compatible
• 8-Ball DSBGA, 1.9 mm × 1.9 mm × 0.625 mm Package

TMP007EVM Kit Contents

1. TMP007 test board
2. SM-USB-DIG board
3. USB drive with TMP007 GUI software 

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