Datasheet Texas Instruments 74ACT11139

ManufacturerTexas Instruments
Series74ACT11139
Datasheet Texas Instruments 74ACT11139

Dual 2-Line to 4-Line Decoder/Demultiplexer

Datasheets

Dual 2-Line To 4-Line Decoder/Demultiplexer datasheet
PDF, 803 Kb, Revision: A, File published: Apr 1, 1996
Extract from the document

Prices

Status

74ACT11139D74ACT11139DR74ACT11139DRE474ACT11139DRG474ACT11139N74ACT11139PWLE74ACT11139PWR
Lifecycle StatusActive (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNo

Packaging

74ACT11139D74ACT11139DR74ACT11139DRE474ACT11139DRG474ACT11139N74ACT11139PWLE74ACT11139PWR
N1234567
Pin16161616161616
Package TypeDDDDNPWPW
Industry STD TermSOICSOICSOICSOICPDIPTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDIP-TR-PDSO-GR-PDSO-G
Package QTY402000
CarrierTUBELARGE T&R
Device MarkingACT11139AT139
Width (mm)3.913.913.913.916.354.44.4
Length (mm)9.99.99.99.919.355
Thickness (mm)1.581.581.581.583.911
Pitch (mm)1.271.271.271.272.54.65.65
Max Height (mm)1.751.751.751.755.081.21.2
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / Models74ACT11139D
74ACT11139D
74ACT11139DR
74ACT11139DR
74ACT11139DRE4
74ACT11139DRE4
74ACT11139DRG4
74ACT11139DRG4
74ACT11139N
74ACT11139N
74ACT11139PWLE
74ACT11139PWLE
74ACT11139PWR
74ACT11139PWR
Approx. Price (US$)1.00 | 1ku1.00 | 1ku1.00 | 1ku1.00 | 1ku1.00 | 1ku
Bandwidth, MHz100100
Bits44
Bits(#)44444
Number of Channels22
Channels(#)22222
Configuration2:42:42:42:42:42:42:4
Digital input leakage(Max), uA55
ESD Charged Device Model, kV0.750.75
ESD HBM, kV22
F @ Nom Voltage(Max), Mhz9090
F @ Nom Voltage(Max)(Mhz)9090909090
FunctionDecoder/DemultiplexerDecoder/DemultiplexerDecoder/DemultiplexerDecoder/DemultiplexerDecoder/DemultiplexerDecoder/DemultiplexerDecoder/Demultiplexer
ICC @ Nom Voltage(Max), mA0.080.08
ICC @ Nom Voltage(Max)(mA)0.080.080.080.080.08
Input TypeTTLTTLTTLTTLTTL
Operating Temperature Range, C-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA24/-2424/-24
Output Drive (IOL/IOH)(Max)(mA)24/-2424/-2424/-2424/-2424/-24
Output TypeCMOSCMOSCMOSCMOSCMOS
Package GroupSOICSOICSOICSOICSOIC
TSSOP
TSSOPTSSOP
Package Size: mm2:W x L, PKG16SOIC: 59 mm2: 6 x 9.9(SOIC)16TSSOP: 32 mm2: 6.4 x 5(TSSOP)
Package Size: mm2:W x L (PKG)See datasheet (PDIP)See datasheet (PDIP)See datasheet (PDIP)See datasheet (PDIP)See datasheet (PDIP)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNoNo
Technology FamilyACTACTACTACTACTACTACT
TypeStandardStandardStandardStandardStandardStandardStandard
VCC(Max), V5.55.5
VCC(Max)(V)5.55.55.55.55.5
VCC(Min), V4.54.5
VCC(Min)(V)4.54.54.54.54.5
Voltage(Nom), V55
Voltage(Nom)(V)55555
tpd @ Nom Voltage(Max), ns7.87.8
tpd @ Nom Voltage(Max)(ns)7.87.87.87.87.8

Eco Plan

74ACT11139D74ACT11139DR74ACT11139DRE474ACT11139DRG474ACT11139N74ACT11139PWLE74ACT11139PWR
RoHSCompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantCompliant
Pb FreeNoNoNoNoNo

Application Notes

  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, File published: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge

Model Line

Manufacturer's Classification

  • Semiconductors> Switches and Multiplexers> Buffered Encoders and Decoders