Datasheet Texas Instruments ISO7320-Q1

ManufacturerTexas Instruments
SeriesISO7320-Q1

Automotive, Low Power, Dual-Channel 2/0 Digital Isolator

Datasheets

ISO732x-Q1 Robust EMC, Low Power, Dual-Channel Digital Isolators datasheet
PDF, 1.3 Mb, File published: Nov 16, 2015
Extract from the document

Prices

Status

ISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesNoYes

Packaging

ISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
N1234
Pin8888
Package TypeDDDD
Industry STD TermSOICSOICSOICSOIC
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY752500752500
CarrierTUBELARGE T&RTUBELARGE T&R
Device Marking7320Q7320Q7320FQ7320FQ
Width (mm)3.913.913.913.91
Length (mm)4.94.94.94.9
Thickness (mm)1.581.581.581.58
Pitch (mm)1.271.271.271.27
Max Height (mm)1.751.751.751.75
Mechanical DataDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
Data Rate(Max), Mbps25252525
Default OutputHighHighLowLow
Forward/Reverse Channels2/02/02/02/0
Integrated Isolated PowerNoNoNoNo
Isolation Rating, Vrms3000300030003000
Number of Channels2222
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupSOICSOICSOICSOIC
Package Size: mm2:W x L, PKG8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)
Propagation Delay, ns31313131
Propagation Delay(Typ), ns31313131
RatingAutomotiveAutomotiveAutomotiveAutomotive
Surge Voltage Rating, Vpk6000600060006000
VCC(Max), V5555
VCC(Min), V3.33.33.33.3

Eco Plan

ISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
RoHSCompliantCompliantCompliantCompliant

Application Notes

  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, File published: May 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Model Line

Manufacturer's Classification

  • Semiconductors> Isolation> Digital Isolators