Datasheet Texas Instruments SN54CBT16212A

ManufacturerTexas Instruments
SeriesSN54CBT16212A
Datasheet Texas Instruments SN54CBT16212A

24-BIT FET BUS-EXCHANGE SWITCHES

Datasheets

SN54CBT16212A, SN74CBT16212A datasheet
PDF, 1.2 Mb, Revision: U, File published: Jun 14, 2005
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Prices

Status

5962-9852101QXASNJ54CBT16212AWD
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNo

Packaging

5962-9852101QXASNJ54CBT16212AWD
N12
Pin5656
Package TypeWDWD
Industry STD TermCFPCFP
JEDEC CodeR-GDFP-FR-GDFP-F
Package QTY11
CarrierTUBETUBE
Device Marking5962-9852101QX5962-9852101QX
Width (mm)9.669.66
Length (mm)18.4218.42
Thickness (mm)2.482.48
Pitch (mm).635.635
Max Height (mm)3.053.05
Mechanical DataDownloadDownload

Parametrics

Parameters / Models5962-9852101QXA
5962-9852101QXA
SNJ54CBT16212AWD
SNJ54CBT16212AWD
Number of Channels2424
Operating Temperature Range, C-55 to 125-55 to 125
Package GroupCFPCFP
Package Size: mm2:W x L, PKGSee datasheet (CFP)See datasheet (CFP)
RatingMilitaryMilitary
Ron(Max), Ohms77
Technology FamilyCBTCBT
VCC(Max), V5.55.5
VCC(Min), V44

Eco Plan

5962-9852101QXASNJ54CBT16212AWD
RoHSSee ti.comSee ti.com

Application Notes

  • Flexible Voltage-Level Translation With CBT Family Devices
    PDF, 40 Kb, File published: Jul 20, 1999
    Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
  • 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
    PDF, 35 Kb, Revision: B, File published: Mar 1, 1997
    The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
  • 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
    PDF, 32 Kb, Revision: A, File published: Apr 3, 1998
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, File published: Feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Mb, Revision: A, File published: Jul 26, 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, File published: May 1, 1996
  • Selecting the Right Texas Instruments Signal Switch
    PDF, 769 Kb, File published: Sep 7, 2001
    Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, File published: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Kb, File published: Nov 1, 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, File published: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, File published: Jun 23, 2016

Model Line

Series: SN54CBT16212A (2)

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Switches and Multiplexer> Signal Switch