Datasheet Texas Instruments SN54CBTD3384

Manufacturer	Texas Instruments
Series	SN54CBTD3384

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Packaging

Parametrics

Parameters / Models	5962-9752701Q3A	5962-9752701QKA	5962-9752701QLA	SNJ54CBTD3384FK	SNJ54CBTD3384JT	SNJ54CBTD3384W
Number of Channels	10	10	10	10	10	10
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Package Group	LCCC	CFP	CDIP	LCCC	CDIP	CFP
Package Size: mm2:W x L, PKG	28LCCC: 131 mm2: 11.43 x 11.43(LCCC)	See datasheet (CFP)	See datasheet (CDIP)	28LCCC: 131 mm2: 11.43 x 11.43(LCCC)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military	Military
Ron(Max), Ohms	7	7	7	7	7	7
Ron(Typ), Ohms	5	5	5	5	5	5
Technology Family	CBT	CBT	CBT	CBT	CBT	CBT
VCC(Max), V	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Min), V	4.5	4.5	4.5	4.5	4.5	4.5

Eco Plan

Application Notes

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  PDF, 1.1 Mb, Revision: A, File published: Jul 26, 2016
  TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
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  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, File published: May 1, 1996
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  Flexible Voltage-Level Translation With CBT Family Devices
  PDF, 40 Kb, File published: Jul 20, 1999
  Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
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  Selecting the Right Texas Instruments Signal Switch
  PDF, 769 Kb, File published: Sep 7, 2001
  Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, File published: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
  PDF, 115 Kb, File published: Dec 1, 1997
  This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
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  5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
  PDF, 35 Kb, Revision: B, File published: Mar 1, 1997
  The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
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  3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
  PDF, 32 Kb, Revision: A, File published: Apr 3, 1998
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  Bus FET Switch Solutions for Live Insertion Applications
  PDF, 300 Kb, File published: Feb 7, 2003
  In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
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  Texas Instruments Little Logic Application Report
  PDF, 359 Kb, File published: Nov 1, 2002
  Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, File published: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, Revision: B, File published: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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  Selecting the Right Level Translation Solution (Rev. A)
  PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
  Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
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  Implications of Slow or Floating CMOS Inputs (Rev. D)
  PDF, 260 Kb, Revision: D, File published: Jun 23, 2016

Model Line

Manufacturer's Classification

• Semiconductors> Space & High Reliability> Logic Products> Switches and Multiplexer> Signal Switch