Datasheet Texas Instruments SN74ABT16540A

ManufacturerTexas Instruments
SeriesSN74ABT16540A
Datasheet Texas Instruments SN74ABT16540A

16-Bit Buffers/Drivers With 3-State Outputs

Datasheets

16-Bit Buffers/Drivers With 3-State Outputs datasheet
PDF, 300 Kb, Revision: C, File published: Apr 1, 1997
Extract from the document

Prices

Status

SN74ABT16540ADGGRSN74ABT16540ADLSN74ABT16540ADLG4SN74ABT16540ADLR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

Packaging

SN74ABT16540ADGGRSN74ABT16540ADLSN74ABT16540ADLG4SN74ABT16540ADLR
N1234
Pin48484848
Package TypeDGGDLDLDL
Industry STD TermTSSOPSSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY200025251000
CarrierLARGE T&RTUBETUBELARGE T&R
Device MarkingABT16540AABT16540AABT16540AABT16540A
Width (mm)6.17.497.497.49
Length (mm)12.515.8815.8815.88
Thickness (mm)1.152.592.592.59
Pitch (mm).5.635.635.635
Max Height (mm)1.22.792.792.79
Mechanical DataDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsSN74ABT16540ADGGR
SN74ABT16540ADGGR
SN74ABT16540ADL
SN74ABT16540ADL
SN74ABT16540ADLG4
SN74ABT16540ADLG4
SN74ABT16540ADLR
SN74ABT16540ADLR
Bits6666
F @ Nom Voltage(Max), Mhz150150150150
ICC @ Nom Voltage(Max), mA0.0330.0330.0330.033
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA-32/64-32/64-32/64-32/64
Package GroupTSSOPSSOPSSOPSSOP
Package Size: mm2:W x L, PKG48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
RatingCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNo
Technology FamilyABTABTABTABT
VCC(Max), V5.55.55.55.5
VCC(Min), V4.54.54.54.5
Voltage(Nom), V5555
tpd @ Nom Voltage(Max), ns4.34.34.34.3

Eco Plan

SN74ABT16540ADGGRSN74ABT16540ADLSN74ABT16540ADLG4SN74ABT16540ADLR
RoHSCompliantCompliantCompliantCompliant

Application Notes

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    Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
  • Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
    PDF, 528 Kb, Revision: B, File published: Jun 1, 1997
    The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
  • Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
    PDF, 115 Kb, Revision: A, File published: Mar 1, 1997
    Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
  • Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
    PDF, 80 Kb, Revision: A, File published: Dec 1, 1996
    This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, File published: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, File published: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Model Line

Manufacturer's Classification

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Inverting Buffer/Driver
EMS supplier