Datasheet Texas Instruments SN74ALVCH162721

ManufacturerTexas Instruments
SeriesSN74ALVCH162721
Datasheet Texas Instruments SN74ALVCH162721

3.3-V 20-Bit Flip-Flop With 3-State Outputs

Datasheets

SN74ALVCH162721 datasheet
PDF, 339 Kb, Revision: G, File published: Sep 17, 2004
Extract from the document

Prices

Status

74ALVCH162721GRE4SN74ALVCH162721DGGRSN74ALVCH162721DLRSN74ALVCH162721GR
Lifecycle StatusActive (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

Packaging

74ALVCH162721GRE4SN74ALVCH162721DGGRSN74ALVCH162721DLRSN74ALVCH162721GR
N1234
Pin56565656
Package TypeDGGDGGDLDGG
Industry STD TermTSSOPTSSOPSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY200010002000
CarrierLARGE T&RLARGE T&RLARGE T&R
Device MarkingALVCH162721ALVCH162721ALVCH162721
Width (mm)6.16.17.496.1
Length (mm)141418.4114
Thickness (mm)1.151.152.591.15
Pitch (mm).5.5.635.5
Max Height (mm)1.21.22.791.2
Mechanical DataDownloadDownloadDownloadDownload

Parametrics

Parameters / Models74ALVCH162721GRE4
74ALVCH162721GRE4
SN74ALVCH162721DGGR
SN74ALVCH162721DGGR
SN74ALVCH162721DLR
SN74ALVCH162721DLR
SN74ALVCH162721GR
SN74ALVCH162721GR
3-State OutputYesYesYesYes
Approx. Price (US$)1.65 | 1ku
Bits202020
Bits(#)20
F @ Nom Voltage(Max), Mhz150150150
F @ Nom Voltage(Max)(Mhz)150
ICC @ Nom Voltage(Max), mA0.040.040.04
ICC @ Nom Voltage(Max)(mA)0.04
Input TypeLVTTL
CMOS
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85
Output Drive (IOL/IOH)(Max), mA12/-1212/-1212/-12
Output Drive (IOL/IOH)(Max)(mA)12/-12
Output TypeLVTTL
CMOS
Package GroupTSSOPTSSOPSSOPTSSOP
Package Size: mm2:W x L, PKG56TSSOP: 113 mm2: 8.1 x 14(TSSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)56TSSOP: 113 mm2: 8.1 x 14(TSSOP)
Package Size: mm2:W x L (PKG)56TSSOP: 113 mm2: 8.1 x 14(TSSOP)
RatingCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNo
Technology FamilyALVCALVCALVCALVC
VCC(Max), V3.63.63.6
VCC(Max)(V)3.6
VCC(Min), V1.651.651.65
VCC(Min)(V)1.65
Voltage(Nom), V1.8,2.5,2.7,3.31.8,2.5,2.7,3.31.8,2.5,2.7,3.3
Voltage(Nom)(V)1.8
2.5
2.7
3.3
tpd @ Nom Voltage(Max), ns6.7,6.2,5.36.7,6.2,5.36.7,6.2,5.3
tpd @ Nom Voltage(Max)(ns)6.7
6.2
5.3

Eco Plan

74ALVCH162721GRE4SN74ALVCH162721DGGRSN74ALVCH162721DLRSN74ALVCH162721GR
RoHSCompliantNot CompliantCompliantCompliant
Pb FreeNo

Application Notes

  • TI SN74ALVC16835 Component Specification Analysis for PC100
    PDF, 43 Kb, File published: Aug 3, 1998
    The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
  • Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
    PDF, 96 Kb, Revision: A, File published: May 13, 1998
    Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
  • Bus-Hold Circuit
    PDF, 418 Kb, File published: Feb 5, 2001
    When designing systems that include CMOS devices, designers must pay special attention to the operating condition in which all of the bus drivers are in an inactive, high-impedance condition (3-state). Unless special measures are taken, this condition can lead to undefined levels and, thus, to a significant increase in the device?s power dissipation. In extreme cases, this leads to oscillation of
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, File published: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Kb, Revision: A, File published: Sep 8, 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, File published: May 1, 1996
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, File published: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Live Insertion
    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, File published: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, Revision: A, File published: Feb 6, 2015

Model Line

Manufacturer's Classification

  • Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Flip-Flop
EMS supplier