Datasheet Toshiba TLP241B

TLP241B,TLP241BF
Photocouplers Photorelay TLP241B,TLP241BF
1. Applications
• Mechanical relay replacements • Security Systems • Heating, ventilation and air conditioning (HVAC) • ATE (Automatic Test Equipment) • Factory Automation (FA) • Battery Management System (BMS) (Non-Automotive) 2. General
The TLP241B and TLP241BF photorelay consist of a photo MOSFET optically coupled to an infrared light emitting
diode. They are housed in a 4-pin DIP package. They provide an isolation voltage of 5000 Vrms, making them
suitable for applications that require reinforced insulation. 3. Features
(1) Halogen-free
For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet. (2) Normally opened (1-Form-A) (3) OFF-state output terminal voltage: 100 V (min) (4) Trigger LED current: 3 mA (max) (5) ON-state current: 2.0 A (max) (6) ON-state resistance: 200 mΩ (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5 (Note 1)
Note 1: When an EN 60747-5-5 approved type is needed, please designate the Option (D4) . 4. Mechanical Parameters
7.62-mm Pitch
TLP241B 10.16-mm Pitch
TLP241BF Unit Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Characteristics Start of commercial production 2020-12
©2020
Toshiba Electronic Devices & Storage Corporation 1 2020-12-02
Rev.1.0 TLP241B,TLP241BF
5. Packaging (Note)
TLP241B TLP241B(LF1,TP1) TLP241B(LF5,TP5) 11-5B205S 11-5B201S
11-5B2S TLP241BF TLP241BF(LF4,TP4) 11-5B204S
11-5B202S Note: Through-hole type: TLP241B, TLP241BF
Lead forming option: (LF1), (LF4), (LF5) …