Datasheet MCP6281, MCP6281R, MCP6282, MCP6283, MCP6284, MCP6285 (Microchip) - 4

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MCP6281/1R/2/3/4/5 TEMPERATURE SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, VDD = +2.2V to +5.5V and VSS = GND.
Parameters Sym Min Typ Max Units Conditions Temperature Ranges
Operating Temperature Range TA -40 — +125 °C
Note
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23 θJA — 256 — °C/W Thermal Resistance, 6L-SOT-23 θJA — 230 — °C/W Thermal Resistance, 8L-PDIP θJA — 85 — °C/W Thermal Resistance, 8L-SOIC θJA — 163 — °C/W Thermal Resistance, 8L-MSOP θJA — 206 — °C/W Thermal Resistance, 14L-PDIP θJA — 70 — °C/W Thermal Resistance, 14L-SOIC θJA — 120 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W
Note:
The Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.
1.1 Test Circuits
The test circuits used for the DC and AC tests are shown in Figure 1-2 and Figure 1-2. The bypass capacitors are laid out according to the rules discussed in
Section 4.6 “Supply Bypass”
. VDD 1 µF V 0.1 µF IN R V N OUT
MCP628X
CL RL R V G RF DD/2 VL
FIGURE 1-2:
AC and DC Test Circuit for Most Non-Inverting Gain Conditions. VDD 1 µF V 0.1 µF DD/2 R V N OUT
MCP628X
CL RL R V G RF IN VL
FIGURE 1-3:
AC and DC Test Circuit for Most Inverting Gain Conditions. DS21811E-page 4 © 2008 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Timing Diagram for the Chip Select (CS) pin on the MCP6283 and MCP6285. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Bias Current at TA = +85 ˚C. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 2.2V. FIGURE 2-4: Input Offset Voltage Drift. FIGURE 2-5: Input Bias Current at TA = +125 ˚C. FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage. FIGURE 2-8: CMRR, PSRR vs. Frequency. FIGURE 2-9: Input Bias, Offset Currents vs. Common Mode Input Voltage at TA = +85˚C. FIGURE 2-10: Input Bias, Input Offset Currents vs. Ambient Temperature. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Common Mode Input Voltage at TA = +125˚C. FIGURE 2-13: Quiescent Current vs. Power Supply Voltage. FIGURE 2-14: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-15: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-16: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-17: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-18: Slew Rate vs. Ambient Temperature. FIGURE 2-19: Input Noise Voltage Density vs. Frequency. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Quiescent Current vs. Chip Select (CS) Voltage at VDD = 2.2V (MCP6283 and MCP6285 only). FIGURE 2-22: Input Noise Voltage Density vs. Common Mode Input Voltage at 1 kHz. FIGURE 2-23: Channel-to-Channel Separation vs. Frequency (MCP6282 and MCP6284 only). FIGURE 2-24: Quiescent Current vs. Chip Select (CS) Voltage at VDD = 5.5V (MCP6283 and MCP6285 only). FIGURE 2-25: Large-Signal, Non-inverting Pulse Response. FIGURE 2-26: Small-Signal, Non-inverting Pulse Response. FIGURE 2-27: Chip Select (CS) to Amplifier Output Response Time at VDD = 2.2V (MCP6283 and MCP6285 only). FIGURE 2-28: Large-Signal, Inverting Pulse Response. FIGURE 2-29: Small-Signal, Inverting Pulse Response. FIGURE 2-30: Chip Select (CS) to Amplifier Output Response Time at VDD = 5.5V (MCP6283 and MCP6285 only). FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: The MCP6281/1R/2/3/4/5 Show No Phase Reversal. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table for Single Op Amps TABLE 3-2: Pin Function Table for Dual and Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 MCP6285’s VOUTA/VINB+ Pin 3.4 Chip Select Digital Input (CS) 3.5 Power Supply Pins 4.0 Application infoRmation 4.1 Rail-to-Rail Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads. FIGURE 4-4: Recommended RISO Values for Capacitive Loads. 4.4 MCP628X Chip Select (CS) 4.5 Cascaded Dual Op Amps (MCP6285) FIGURE 4-5: Cascaded Gain Amplifier. 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-8: Sallen-Key High-Pass Filter. FIGURE 4-9: Miller Integrator. FIGURE 4-10: Isolating the Load with a Buffer. FIGURE 4-11: Cascaded Gain Circuit Configuration. FIGURE 4-12: Difference Amplifier Circuit. FIGURE 4-13: Buffered Non-inverting Integrator with Chip Select. FIGURE 4-14: Integrator Circuit with Active Compensation. FIGURE 4-15: Second-Order Multiple Feedback Low-Pass Filter with an Extra Pole-Zero Pair. FIGURE 4-16: Second-Order Sallen-Key Low-Pass Filter with an Extra Pole-Zero Pair and Chip Select. FIGURE 4-17: Capacitorless Second-Order Low-Pass Filter with Chip Select. 5.0 Design AIDS 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Circuit Designer & Simulator 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information