Datasheet ADA4805-1, ADA4805-2 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | 0.2 µV/°C Offset Drift, 105 MHz Low Power, Low Noise, Rail-to-Rail Amplifier |
| Pages / Page | 25 / 7 — Data Sheet. ADA4805-1/ADA4805-2. ABSOLUTE MAXIMUM RATINGS Table 5. … |
| Revision | B |
| File Format / Size | PDF / 784 Kb |
| Document Language | English |
Data Sheet. ADA4805-1/ADA4805-2. ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating. THERMAL RESISTANCE
Model Line for this Datasheet
Text Version of Document
link to page 7 link to page 7 link to page 7
Data Sheet ADA4805-1/ADA4805-2 ABSOLUTE MAXIMUM RATINGS Table 5.
The quiescent power dissipation is the voltage between the supply pins (V
Parameter Rating
S) multiplied by the quiescent current (IS). Supply Voltage 11 V PD = Quiescent Power + (Total Drive Power − Load Power) Power Dissipation See Figure 3 V V V 2 Common-Mode Input Voltage −V P V I D S S S OUT OUT S − 0.7 V to +VS + 0.7 V Differential Input Voltage ±1 V 2 R R L L Storage Temperature Range −65°C to +125°C RMS output voltages must be considered. If RL is referenced Operating Temperature Range −40°C to +125°C to −VS, as in single-supply operation, the total drive power is Lead Temperature (Soldering, 10 sec) 300°C VS × IOUT. If the rms signal levels are indeterminate, consider the Junction Temperature 150°C worst case, when VOUT = VS/4 for RL to midsupply. Stresses at or above those listed under Absolute Maximum V 2 / 4 P V I D S S S Ratings may cause permanent damage to the product. This is a RL stress rating only; functional operation of the product at these In single-supply operation with R or any other conditions above those indicated in the operational L referenced to −VS, worst case is V section of this specification is not implied. Operation beyond OUT = VS/2. the maximum operating conditions for extended periods may Airflow increases heat dissipation, effectively reducing θJA. Also, affect product reliability. more metal directly in contact with the package leads and exposed pad from metal traces, through holes, ground, and
THERMAL RESISTANCE
power planes reduces θJA. θJA is specified for the worst case conditions, that is, θJA is specified Figure 3 shows the maximum safe power dissipation in the for a device soldered in a circuit board for surface-mount packages. package vs. the ambient temperature on a JEDEC standard, Table 6 lists the θJA for the ADA4805-1/ADA4805-2. 4-layer board. θJA values are approximations.
Table 6. Thermal Resistance 4.0 TJ = 150°C Package Type θJA Unit ) 3.5
6-Lead SC70 223.6 °C/W
W ( 10-LEAD LFCSP
6-Lead SOT-23 209.1 °C/W
ON 3.0 TI
8-Lead MSOP 123.8 °C/W
A P 2.5
10-Lead LFCSP 51.4 °C/W
ISSI D R 2.0 E MAXIMUM POWER DISSIPATION W 1.5 8-LEAD MSOP
The maximum safe power dissipation for the ADA4805-1/
M PO MU 6-LEAD SOT-23
ADA4805-2 is limited by the associated rise in junction
1.0 XI
temperature (T
MA
J) on the die. At approximately 150C, which is
0.5
the glass transition temperature, the properties of the plastic
6-LEAD SC70 0
change. Even temporarily exceeding this temperature limit may 1 1
–50 –30 –10 10 30 50 70 90 110 130
0 45- change the stresses that the package exerts on the die, permanently
AMBIENT TEMPERATURE (°C)
13 1 shifting the parametric performance of the ADA4805-1/ADA4805-2. Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board Exceeding a junction temperature of 175C for an extended
ESD CAUTION
period of time can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the ADA4805-1/ADA4805-2 output load drive. Rev. B | Page 7 of 25 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATIONS CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY 5 V SUPPLY 3 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION AMPLIFIER DESCRIPTION INPUT PROTECTION SHUTDOWN OPERATION NOISE CONSIDERATIONS APPLICATIONS INFORMATION SLEW ENHANCEMENT EFFECT OF FEEDBACK RESISTOR ON FREQUENCY RESPONSE COMPENSATING PEAKING IN LARGE SIGNAL FREQUENCY RESPONSE DRIVING LOW POWER, HIGH RESOLUTION SUCCESSIVE APPROXIMATION REGISTER (SAR) ADCs DYNAMIC POWER SCALING SINGLE-ENDED TO DIFFERENTIAL CONVERSION LAYOUT CONSIDERATIONS Ground Plane Power Supply Bypassing OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADA4805-1/ADA4805-2 ABSOLUTE MAXIMUM RATINGS Table 5.
The quiescent power dissipation is the voltage between the supply pins (V
Parameter Rating
S) multiplied by the quiescent current (IS). Supply Voltage 11 V PD = Quiescent Power + (Total Drive Power − Load Power) Power Dissipation See Figure 3 V V V 2 Common-Mode Input Voltage −V P V I D S S S OUT OUT S − 0.7 V to +VS + 0.7 V Differential Input Voltage ±1 V 2 R R L L Storage Temperature Range −65°C to +125°C RMS output voltages must be considered. If RL is referenced Operating Temperature Range −40°C to +125°C to −VS, as in single-supply operation, the total drive power is Lead Temperature (Soldering, 10 sec) 300°C VS × IOUT. If the rms signal levels are indeterminate, consider the Junction Temperature 150°C worst case, when VOUT = VS/4 for RL to midsupply. Stresses at or above those listed under Absolute Maximum V 2 / 4 P V I D S S S Ratings may cause permanent damage to the product. This is a RL stress rating only; functional operation of the product at these In single-supply operation with R or any other conditions above those indicated in the operational L referenced to −VS, worst case is V section of this specification is not implied. Operation beyond OUT = VS/2. the maximum operating conditions for extended periods may Airflow increases heat dissipation, effectively reducing θJA. Also, affect product reliability. more metal directly in contact with the package leads and exposed pad from metal traces, through holes, ground, and
THERMAL RESISTANCE
power planes reduces θJA. θJA is specified for the worst case conditions, that is, θJA is specified Figure 3 shows the maximum safe power dissipation in the for a device soldered in a circuit board for surface-mount packages. package vs. the ambient temperature on a JEDEC standard, Table 6 lists the θJA for the ADA4805-1/ADA4805-2. 4-layer board. θJA values are approximations.
Table 6. Thermal Resistance 4.0 TJ = 150°C Package Type θJA Unit ) 3.5
6-Lead SC70 223.6 °C/W
W ( 10-LEAD LFCSP
6-Lead SOT-23 209.1 °C/W
ON 3.0 TI
8-Lead MSOP 123.8 °C/W
A P 2.5
10-Lead LFCSP 51.4 °C/W
ISSI D R 2.0 E MAXIMUM POWER DISSIPATION W 1.5 8-LEAD MSOP
The maximum safe power dissipation for the ADA4805-1/
M PO MU 6-LEAD SOT-23
ADA4805-2 is limited by the associated rise in junction
1.0 XI
temperature (T
MA
J) on the die. At approximately 150C, which is
0.5
the glass transition temperature, the properties of the plastic
6-LEAD SC70 0
change. Even temporarily exceeding this temperature limit may 1 1
–50 –30 –10 10 30 50 70 90 110 130
0 45- change the stresses that the package exerts on the die, permanently
AMBIENT TEMPERATURE (°C)
13 1 shifting the parametric performance of the ADA4805-1/ADA4805-2. Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board Exceeding a junction temperature of 175C for an extended
ESD CAUTION
period of time can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the ADA4805-1/ADA4805-2 output load drive. Rev. B | Page 7 of 25 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATIONS CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY 5 V SUPPLY 3 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION AMPLIFIER DESCRIPTION INPUT PROTECTION SHUTDOWN OPERATION NOISE CONSIDERATIONS APPLICATIONS INFORMATION SLEW ENHANCEMENT EFFECT OF FEEDBACK RESISTOR ON FREQUENCY RESPONSE COMPENSATING PEAKING IN LARGE SIGNAL FREQUENCY RESPONSE DRIVING LOW POWER, HIGH RESOLUTION SUCCESSIVE APPROXIMATION REGISTER (SAR) ADCs DYNAMIC POWER SCALING SINGLE-ENDED TO DIFFERENTIAL CONVERSION LAYOUT CONSIDERATIONS Ground Plane Power Supply Bypassing OUTLINE DIMENSIONS ORDERING GUIDE
