Datasheet AD8002 (Analog Devices) - 6

Data Sheet AD8002 ABSOLUTE MAXIMUM RATINGS
Although the AD8002 is internal y short-circuit protected, this
Table 2.
may not be sufficient to guarantee that the maximum junction
Parameter Rating
temperature (150°C) is not exceeded under all conditions. Supply Voltage 13.2 V To ensure proper operation, it is necessary to observe the Internal Power Dissipation1 maximum power derating curves. SOIC (R) 0.9 W
2.0
MSOP (RM) 0.6 W
TJ = 150°C
Input Common-Mode Voltage ±VS
)
Differential Input Voltage ±1.2 V
(W 8-LEAD SOIC PACKAGE N 1.5
Output Short-Circuit Duration Observe power
IO T
derating curves
PA
Storage Temperature Range −65°C to +125°C
ISSI D 1.0
Operating Temperature Range −40°C to +85°C
ER W
Lead Temperature (Soldering 10 sec) 300°C
M PO 8-LEAD MSOP
1 Specification is for device in free air:
MU 0.5 PACKAGE
8-lead SOIC: θ
XI
JA = 155°C/W. 8-lead MSOP: θ
MA
JA = 200°C/W. Stresses at or above those listed under Absolute Maximum
0
Ratings may cause permanent damage to the product. This is a
– 0 5 –40 –30 –20 –10 0 10 20 30 40 50 60 70 0 8 90
004 stress rating only; functional operation of the product at these
AMBIENT TEMPERATURE (°C)
01044- or any other conditions above those indicated in the operational Figure 3. Maximum Power Dissipation vs. Ambient Temperature section of this specification is not implied. Operation beyond
ESD CAUTION
the maximum operating conditions for extended periods may affect product reliability.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8002 is limited by the associated rise in junction temper- ature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Exceeding this limit temporarily may cause a shift in parametric perfor- mance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. Rev. E | Page 5 of 21 Document Outline Features Applications General Description Pin Connection Block Diagram Table of Contents Revision History Specifications Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Test Circuits Theory of Operation Choice of Feedback and Gain Resistors Printed Circuit Board (PCB) Layout Considerations Power Supply Bypassing DC Errors and Noise Driving Capacitive Loads Communications Operation as a Video Line Driver Driving ADCs Single-Ended-to-Differential Driver Using an AD8002 Applications Information Layout Considerations Outline Dimensions Ordering Guide