Datasheet AD8661, AD8662, AD8664 (Analog Devices) - 13

Data Sheet AD8661/AD8662/AD8664 OUTLINE DIMENSIONS 5.00 (0.1968) 4.80 (0.1890) 8 5 4.00 (0.1574) 6.20 (0.2440) 1 3.80 (0.1497) 5.80 (0.2284) 4 1.27 (0.0500) 0.50 (0.0196) 45° BSC 1.75 (0.0688) 0.25 (0.0099) 1.35 (0.0532) 0.25 (0.0098) 8° 0.10 (0.0040) 0° COPLANARITY 0.51 (0.0201) 1.27 (0.0500) 0.10 0.31 (0.0122) 0.25 (0.0098) SEATING 0.40 (0.0157) PLANE 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012-A A CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS A (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 060506-
Figure 34. 8-Lead Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches)
1.84 3.10 1.74 3.00 SQ 1.64 2.90 0.50 BSC 5 8 PIN 1 INDEX EXPOSED 1.55 AREA PAD 1.45 1.35 0.50 0.40 0.30 4 1 PIN 1 TOP VIEW BOTTOM VIEW INDICATOR (R 0.15) 0.80 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO 0.75 SIDE VIEW 0.05 MAX THE PIN CONFIGURATION AND 0.70 0.02 NOM FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET. SEATING 0.30 0.08 PLANE 0.25 0.203 REF A 0.20 2016- 1- 1 COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4 05-
Figure 35. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-13) Dimensions shown in millimeters Rev. E | Page 13 of 16 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AD8661/AD8662/AD8664 ELECTRICAL CHARACTERISTICS—SOIC, MSOP, AND TSSOP AD8661/AD8662/AD8664 ELECTRICAL CHARACTERISTICS—SOIC, MSOP, AND TSSOP AD8661 ELECTRICAL CHARACTERISTICS—LFCSP ONLY AD8661 ELECTRICAL CHARACTERISTICS—LFCSP ONLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE NOTES