Datasheet AD843 (Analog Devices) - 4

ManufacturerAnalog Devices
Description34 MHz, CBFET Fast Settling Op Amp
Pages / Page13 / 4 — AD843. boldface. ABSOLUTE MAXIMUM RATINGS1. METALIZATION PHOTOGRAPH
RevisionD
File Format / SizePDF / 491 Kb
Document LanguageEnglish

AD843. boldface. ABSOLUTE MAXIMUM RATINGS1. METALIZATION PHOTOGRAPH

AD843 boldface ABSOLUTE MAXIMUM RATINGS1 METALIZATION PHOTOGRAPH

Model Line for this Datasheet

AD843

Text Version of Document

AD843
NOTES 1Standard Military Drawings Available: 5962-9098001M2A (SE/883B), 5962-9098001MXA (SH/883B), 5962-9098001MPA (SQ/883B). 2Specifications are guaranteed after 5 minutes at TA = +25°C. 3Full power bandwidth = Slew Rate/2 πV peak. 4All “S” grade TMIN-TMAX specifications are tested with automatic test equipment at TA = –55°C and TA = +125°C. Specifications subject to change without notice. Specifications in
boldface
are tested on all production units at final electrical test. Results from those tests are used to calculate outgoing quality levels. All min and max specifications are guaranteed although only those shown in
boldface
are tested on all production units.
ABSOLUTE MAXIMUM RATINGS1 METALIZATION PHOTOGRAPH
Supply Voltage . .± 18 V Contact factory for latest dimensions. Internal Power Dissipation2 Dimensions shown in inches and (mm). Plastic Package . 1.50 Watts Cerdip Package . 1.35 Watts 12-Pin Header Package . 1.80 Watts 16-Pin SOIC Package . 1.50 Watts 20-Pin LCC Package . 1.00 Watt Input Voltage . ± VS Output Short Circuit Duration . Indefinite Differential Input Voltage . +VS and –VS Storage Temperature Range (N, R) . –65°C to +125°C Storage Temperature Range (Q, H, E) . –65°C to +150°C Operating Temperature Range AD843J/R . 0°C to +70°C AD843A/B . –40°C to +85°C AD843S . –55°C to +125°C Lead Temperature Range (Soldering 60 sec) . +300°C ESD Rating . 500 V NOTES 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 28-Pin Plastic Package: θJA = 100°C/Watt 8-Pin Cerdip Package: θJA = 110°C/Watt 12-Pin Header Package: θJA = 80°C/Watt 16-Pin SOIC Package: θJA = 100°C/Watt 20-Pin LCC Package: θJA = 150°C/Watt REV. D –3–