LTC3130/LTC3130-1 PACKAGE DESCRIPTIONPlease refer to http://www.linear.com/product/LTC3130#packagingfor the most recent package drawings.UDC Package20-Lead Plastic QFN (3mm × 4mm) (Reference LTC DWG # 05-08-1742 Rev Ø) 0.70 ±0.05 3.50 ±0.05 2.10 ±0.05 2.65 ±0.05 1.50 REF 1.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 2.50 REF 3.10 ±0.05 4.50 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH 0.75 ±0.05 R = 0.20 OR 0.25 3.00 ±0.10 1.50 REF × 45° CHAMFER R = 0.05 TYP 19 20 0.40 ±0.10 PIN 1 1 TOP MARK 2 (NOTE 6) 2.65 ±0.10 4.00 ±0.10 2.50 REF 1.65 ±0.10 (UDC20) QFN 1106 REV Ø 0.200 REF R = 0.115 0.25 ±0.05 0.00 – 0.05 TYP 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3130f 36 For more information www.linear.com/LTC3130 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Typical Performance Characteristics Pin Functions LTC3130 Block Diagram LTC3130-1 Block Diagram Operation Applications Information Package Description Typical Application Related Parts