AD9267PIN CONFIGURATION AND FUNCTION DESCRIPTIONST+DBBDTFDAADEKNDNDD–+–+NDNNDILEDNNDSBCLCGAGAVVIVIAVCFVRAVVIVIAVAGRECS64636261605958575655545352515049CLK–1PIN 148 SCLK/PLLMULT0INDICATORCVDD247 SDIO/PLLMULT1PDWNA346 PLLMULT2PDWNB445 PLLMULT3PLL_LOCKED544 PLLMULT4AD9267DVDD643 DVDDDGND742 DGNDDRVDD841 DRVDDTOP VIEWD0–B940 D3+A(Not to Scale)D0+B 1039 D3–AD1–B 1138 D2+AD1+B 1237 D2–AD2–B 1336 D1+AD2+B 1435 D1–AD3–B 1534 D0+AD3+B 1633 D0–A17181920212223242526272829303132BB–+DAA–+NDDD–+DNCDNCVDDNCDNCDNCDNCDNCORORDCODCODGDVORORDRNOTES 1. DNC = DO NOT CONNECT. 2. THE EXPOSED PAD MUST BE SOLDERED TO THE GROUND PLANE FOR THE LFCSP PACKAGE. SOLDERING THE EXPOSED PADDLE TO THE PCB 3 INCREASES THE RELIABILITY OF THE SOLDER JOINTS, MAXIMIZING -00 THE THERMAL CAPACITY OF THE PACKAGE. 73 77 0 Figure 3. Pin Configuration Table 7. Pin Function Descriptions Pin No.MnemonicDescription 1 CLK− Differential Clock Input (−). 2 CVDD Clock Supply (1.8 V). 3, 4 PDWNA, PDWNB Power-Down Pins. Active high. 5 PLL_LOCKED PLL Lock Indicator. 6, 25, 43 DVDD Digital Supply (1.8 V). 7, 24, 42 DGND Digital Ground. 8, 23, 41 DRVDD Digital Output Driver Supply 9 to 16 D0−B, D0+B to D3−B, D3+B Channel B Differential LVDS Data Output Bits. D0+B is the LSB and D3+B is the MSB. 17, 18 OR−B, OR+B Channel B Overrange Indicator Pins. 19, 20 DCO−, DCO+ Differential Data Clock Output. 21, 22, 26 to 30 DNC Do Not Connect. 31, 32 OR−A, OR+A Channel A Overrange Indicator Pins. 33 to 40 D0−A, D0+A to D3−A, D3+A Channel A Differential LVDS Data Output Bits. D0+A is the LSB and D3+A is the MSB. 44, 45, 46 PLLMULT4, PLLMULT3, PLLMULT2 PLL Mode Selection Pins. 47 SDIO/PLLMULT1 Serial Port Interface Data Input/Output/PLL Mode Selection Pins. 48 SCLK/PLLMULT0 Serial Port Interface Clock/PLL Mode Selection Pins. 49 CSB Serial Port Interface Chip Select Pin Active Low. 50 RESET Chip Reset. 51, 62 AGND Analog Ground. 52, 55, 58, 61 AVDD Analog Supply (1.8 V). 53, 54 VIN+A, VIN−A Channel A Analog Input. 56 VREF Voltage Reference Input. 57 CFILT Noise Limiting Filter Capacitor. 59, 60 VIN+B, VIN−B Channel B Analog Input. 63 CGND Clock Ground. 64 CLK+ Differential Clock Input (+). 65 Exposed paddle (EPAD) Analog Ground. (Pin 65 is the exposed thermal pad on the bottom of the package.) The exposed paddle must be soldered to analog ground of the PCB to achieve optimal electrical and thermal performance. Rev. 0 | Page 8 of 24 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Revision History Specifications DC Specifications AC Specifications Digital Specifications Switching Specifications Timing Diagram Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Equivalent Circuits Theory of Operation Analog Input Considerations Input Common Mode Differential Input Configurations Voltage Reference Internal Reference Connection External Reference Operation Clock Input Considerations Direct Clocking Internal PLL Clock Distribution External PLL Control PLL Autoband Select Power Dissipation and Standby Mode Digital Outputs Digital Output Format Overrange (OR) Condition Timing Serial Port Interface (SPI) Configuration Using the SPI Hardware Interface Applications Information Filtering Requirement Memory Map Memory Map Definitions Outline Dimensions Ordering Guide