Datasheet AD6645 (Analog Devices) - 8

Data Sheet AD6645 ABSOLUTE MAXIMUM RATINGS Table 5.
Values of θJA are provided for package comparison and PCB
Parameter Rating
design considerations. θJA can be used for a first-order approximation of T Electrical J by the equation AVCC Voltage 0 V to 7 V TJ = TA + (θJA × PD) DVCC Voltage 0 V to 7 V where: Analog Input Voltage 0 V to AVCC T Analog Input Current 25 mA A is the ambient temperature (°C). Digital Input Voltage 0 V to AVCC PD is the power dissipation (W). Digital Output Current 4 mA
EXPLANATION OF TEST LEVELS
Environmental Operating Temperature Range (Ambient) I. 100% production tested. AD6645-80 −40°C to +85°C II. 100% production tested at 25°C and guaranteed by design AD6645-105 −10°C to +85°C and characterization at temperature extremes. Maximum Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C III. Sample tested only. Storage Temperature Range (Ambient) −65°C to +150°C IV. Parameter is guaranteed by design and characterization Stresses at or above those listed under Absolute Maximum testing. Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these V. Parameter is a typical value only. or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may
ESD CAUTION
affect product reliability.
THERMAL RESISTANCE
The heat sink of the AD6645ASVZ, 52-lead TQFP_EP (SV-52-1) package must be soldered to the PCB GND plane to meet thermal specifications.
Table 6. Thermal Characteristics Package Type Rating
52-Lead TQFP_EP θJA (0 m/sec airflow)1, 2, 3 23°C/W, soldered heat sink θJMA (1.0 m/sec airflow)2, 3, 4, 5 17°C/W, soldered heat sink θ 6, 7 JC 2°C/W, soldered heat sink 1 Per JEDEC JESD51-2 (heat sink soldered to PCB). 2 2S2P JEDEC test board. 3 Values of θJA are provided for package comparison and PCB design considerations. 4 Per JEDEC JESD51-6 (heat sink soldered to PCB). 5 Airflow increases heat dissipation, effectively reducing θJA. Furthermore, the more metal that is directly in contact with the package leads from metal traces, throughholes, ground, and power planes, the more θJA is reduced. 6 Per MIL-STD-883, Method 1012.1. 7 Values of θJC are provided for package comparison and PCB design considerations when an external heat sink is required. Rev. E | Page 7 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS DC SPECIFICATIONS DIGITAL SPECIFICATIONS AC SPECIFICATIONS SWITCHING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE EXPLANATION OF TEST LEVELS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS EQUIVALENT CIRCUITS TERMINOLOGY THEORY OF OPERATION APPLYING THE AD6645 Encoding the AD6645 Driving the Analog Inputs Power Supplies Digital Outputs Grounding LAYOUT INFORMATION JITTER CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE