AD7721ABSOLUTE MAXIMUM RATINGS1 Lead Temperature, Soldering (10 sec) . +260°C (TA = +25°C unless otherwise stated) Cerdip Package DVDD to DGND . –0.3 V to +7 V θJA Thermal Impedance . 51°C/W AVDD to AGND . –0.3 V to +7 V Lead Temperature, Soldering (10 sec) . +300°C AVDD to DVDD . –0.3 V to +0.3 V SOIC Package AGND to DGND . –0.3 V to +0.3 V θJA Thermal Impedance . 72°C/W Digital Input Voltage to DGND . –0.3 V to DVDD + 0.3 V Lead Temperature, Soldering Analog Input Voltage to AGND . –0.3 V to AVDD + 0.3 V Vapor Phase (60 sec) . +215°C Input Current to Any Pin Except Supplies2 . ± 10 mA Infrared (15 sec) . +220°C Operating Temperature Range NOTES Industrial (A Version) . –40°C to +85°C 1Stresses above those listed under Absolute Maximum Ratings may cause perma- Extended (S Version) . –55°C to +125°C nent damage to the device. This is a stress rating only; functional operation of the Storage Temperature Range . –65°C to +150°C device at these or any other conditions above those listed in the operational Maximum Junction Temperature . +150°C sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Plastic Package 2Transient currents of up to 100 mA will not cause SCR latchup. θJA Thermal Impedance . 74°C/W CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. WARNING! Although this device features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD ESD SENSITIVE DEVICE precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDEPIN CONFIGURATIONModelTemperature RangePackage Option*SCLK/DB7 128 DB6 AD7721AN –40°C to +85°C N-28 DB8 227 AD7721AR –40°C to +85°C R-28 RDDB9 326 AD7721SQ –55°C to +125°C Q-28 WR425 DVAL/RFS/DB10SYNC *N = Plastic DIP; R = 0.3" Small Outline IC (SOIC); Q = Cerdip. SDATA/DB11 524 AGNDAD7721DGND 6TOP VIEW23 VIN2DSUBST 7 (Not to Scale) 22 VIN1DGND821 REFINSTBY/DB0920 AGNDDV1019DDAVDDCAL/DB1 1118 CS1217UNI/DB2CLKDB3 1316 DRDYDB4 1415 SYNC/DB5 REV. A –5–