Datasheet AMP04 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Precision Single Supply Instrumentation Amplifier |
| Pages / Page | 18 / 6 — AMP04. Parameter. Symbol. Conditions. Limit. Unit. ABSOLUTE MAXIMUM … |
| Revision | C |
| File Format / Size | PDF / 557 Kb |
| Document Language | English |
AMP04. Parameter. Symbol. Conditions. Limit. Unit. ABSOLUTE MAXIMUM RATINGS1. DICE CHARACTERISTICS. RGAIN. 7 V+. –IN 2. 6 VOUT. +IN 3. V– 4. 5 REF
Text Version of Document
AMP04 Parameter Symbol Conditions Limit Unit
G = 1000 80 dB min Power Supply Rejection PSRR 4.0 V ≤ VS ≤ 12 V G = 1 85 dB min G = 10 95 dB min G = 100 95 dB min G = 1000 95 dB min GAIN (G = 100 K/RGAIN) Gain Equation Accuracy G = 1 to 100 0.75 % max OUTPUT Output Voltage Swing High VOH RL = 2 kΩ 4.0 V min Output Voltage Swing Low VOL RL = 2 kΩ 2.5 mV max POWER SUPPLY Supply Current ISY VS = ± 15 900 µA max 700 µA max NOTE Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS1 DICE CHARACTERISTICS
Supply Voltage . ± 18 V Common-Mode Input Voltage2 . ± 18 V
RGAIN RGAIN 1 8
Differential Input Voltage . 36 V Output Short-Circuit Duration to GND . Indefinite Storage Temperature Range P, S Package . –65°C to +150°C
7 V+
Operating Temperature Range
–IN 2
AMP04E, F . –40°C to +85°C
6 VOUT +IN 3
Junction Temperature Range P, S Package . –65°C to +150°C Lead Temperature Range (Soldering, 60 sec) . 300°C
V– 4 5 REF Package Type 3 JA JC Unit
8-Lead Plastic DIP (P) 103 43 °C/W 8-Lead SOIC (S) 158 43 °C/W AMP04 Die Size 0.075 × 0.99 inch, 7,425 sq. mils. NOTES Substrate (Die Backside) Is Connected to V+. 1Absolute maximum ratings apply to both DICE and packaged parts, unless Transistor Count, 81. otherwise noted. 2For supply voltages less than ± 18 V, the absolute maximum input voltage is equal to the supply voltage. 3θJA is
s
pecified for the worst case conditions, i.e., θJA is specified for device in socket for a P-DIP package; θJA is specified for device soldered in circuit board for SOIC package. REV. C –5–
G = 1000 80 dB min Power Supply Rejection PSRR 4.0 V ≤ VS ≤ 12 V G = 1 85 dB min G = 10 95 dB min G = 100 95 dB min G = 1000 95 dB min GAIN (G = 100 K/RGAIN) Gain Equation Accuracy G = 1 to 100 0.75 % max OUTPUT Output Voltage Swing High VOH RL = 2 kΩ 4.0 V min Output Voltage Swing Low VOL RL = 2 kΩ 2.5 mV max POWER SUPPLY Supply Current ISY VS = ± 15 900 µA max 700 µA max NOTE Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS1 DICE CHARACTERISTICS
Supply Voltage . ± 18 V Common-Mode Input Voltage2 . ± 18 V
RGAIN RGAIN 1 8
Differential Input Voltage . 36 V Output Short-Circuit Duration to GND . Indefinite Storage Temperature Range P, S Package . –65°C to +150°C
7 V+
Operating Temperature Range
–IN 2
AMP04E, F . –40°C to +85°C
6 VOUT +IN 3
Junction Temperature Range P, S Package . –65°C to +150°C Lead Temperature Range (Soldering, 60 sec) . 300°C
V– 4 5 REF Package Type 3 JA JC Unit
8-Lead Plastic DIP (P) 103 43 °C/W 8-Lead SOIC (S) 158 43 °C/W AMP04 Die Size 0.075 × 0.99 inch, 7,425 sq. mils. NOTES Substrate (Die Backside) Is Connected to V+. 1Absolute maximum ratings apply to both DICE and packaged parts, unless Transistor Count, 81. otherwise noted. 2For supply voltages less than ± 18 V, the absolute maximum input voltage is equal to the supply voltage. 3θJA is
s
pecified for the worst case conditions, i.e., θJA is specified for device in socket for a P-DIP package; θJA is specified for device soldered in circuit board for SOIC package. REV. C –5–
