Datasheet HMC913 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz |
| Pages / Page | 9 / 5 — HMC913. SUCCESSIVE DETECTION LOG VIDEO. AMPLIFER (SDLVA), 0.6 - 20 GHz. … |
| File Format / Size | PDF / 625 Kb |
| Document Language | English |
HMC913. SUCCESSIVE DETECTION LOG VIDEO. AMPLIFER (SDLVA), 0.6 - 20 GHz. Absolute Maximum Ratings. Die Packaging Information
Model Line for this Datasheet
Text Version of Document
HMC913
v04.0913
SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz Absolute Maximum Ratings Die Packaging Information
[1] Vcc +3.6V Standard Alternate IP ENBL +3.6V WP-3 (Waffle Pack) [2] H RF Input Power +15 dBm [1] Refer to the “Packaging Information” section for die Channel Temperature 125 °C packaging dimensions. C Continuous Pdiss (T=85°C) [2] For alternate packaging information contact Hittite - 0.51 W Derate 12.63 mW/°C above 85°C Microwave Corporation. Thermal Resistance R As th 33.94 °C/W NOTES: (Junction to die bottom) 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] LV Storage Temperature -65 to +150 °C 2. DIE THICKNESS IS 0.011 (0.279) 3. TYPICAL BOND PAD IS 0.0024 SQUARE Operating Temperature -55 to +85 °C 4. BOND PAD METALLIZATION: ALUMINUM ESD Sensitivity (HBM) Class 1A 5. NO BACKSIDE METAL SD 6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 7. OVERALL DIE SIZE IS ±.002 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m
5
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p o lica rti a o p n S p u s p @ po h rt itt : P ite ho . n c e om : 1-800-ANALOG-D
v04.0913
SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz Absolute Maximum Ratings Die Packaging Information
[1] Vcc +3.6V Standard Alternate IP ENBL +3.6V WP-3 (Waffle Pack) [2] H RF Input Power +15 dBm [1] Refer to the “Packaging Information” section for die Channel Temperature 125 °C packaging dimensions. C Continuous Pdiss (T=85°C) [2] For alternate packaging information contact Hittite - 0.51 W Derate 12.63 mW/°C above 85°C Microwave Corporation. Thermal Resistance R As th 33.94 °C/W NOTES: (Junction to die bottom) 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] LV Storage Temperature -65 to +150 °C 2. DIE THICKNESS IS 0.011 (0.279) 3. TYPICAL BOND PAD IS 0.0024 SQUARE Operating Temperature -55 to +85 °C 4. BOND PAD METALLIZATION: ALUMINUM ESD Sensitivity (HBM) Class 1A 5. NO BACKSIDE METAL SD 6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 7. OVERALL DIE SIZE IS ±.002 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m
5
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p o lica rti a o p n S p u s p @ po h rt itt : P ite ho . n c e om : 1-800-ANALOG-D
