Datasheet MCP621S, MCP621S, MCP622, MCP623, MCP624, MCP625, MCP629 (Microchip) - 4

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MCP621/1S/2/3/4/5/9 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics:
Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/3, VOUT  VDD/2, VL = VDD/2, RL = 2 k to VL and CAL/CS = VSS (refer to Figure 1-2).
Parameters Sym. Min. Typ. Max. Units Conditions Output
Maximum Output Voltage Swing VOL, VOH VSS + 20 — VDD  20 mV VDD = 2.5V, G = +2, 0.5V Input Overdrive VOL, VOH VSS + 40 — VDD  40 mV VDD = 5.5V, G = +2, 0.5V Input Overdrive Output Short Circuit Current ISC ±40 ±85 ±130 mA VDD = 2.5V
(Note 4 )
ISC ±35 ±70 ±110 mA VDD = 5.5V
(Note 4 ) Calibration Input
Calibration Input Voltage Range VCALRNG VSS + 0.1 — VDD – 1.4 mV VCAL pin externally driven Internal Calibration Voltage VCAL 0.323VDD 0.333VDD 0.343VDD VCAL pin open Input Impedance ZCAL — 100 || 5 — k||pF
Power Supply
Supply Voltage VDD 2.5 — 5.5 V Quiescent Current per Amplifier IQ 1.2 2.5 3.6 mA IO = 0 POR Input Threshold, Low VPRL 1.15 1.40 — V POR Input Threshold, High VPRH — 1.40 1.65 V
Note 1:
Describes the offset (under the specified conditions) right after power-up, or just after the CAL/CS pin is toggled. Thus, 1/f noise effects (an apparent wander in VOS; see Figure 2-35) are not included.
2:
Increment between adjacent VOS trim points; Figure 2-3 shows how this affects the VOS repeatability.
3:
See Figure 2-6 and Figure 2-7 for temperature effects.
4:
The ISC specifications are for design guidance only; they are not tested.
TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT  VDD/2, VL = VDD/2, RL = 2 k to VL, CL = 50 pF and CAL/CS = VSS (refer to Figure 1-2).
Parameters Sym. Min. Typ. Max. Units Conditions AC Response
Gain Bandwidth Product GBWP — 20 — MHz Phase Margin PM — 60 — ° G = +1 Open-Loop Output Impedance ROUT — 15 —
AC Distortion
Total Harmonic Distortion plus THD+N — 0.0018 — % G = +1, VOUT = 2VP-P, f = 1 kHz, Noise VDD = 5.5V, BW = 80 kHz
Step Response
Rise Time, 10% to 90% tr — 13 — ns G = +1, VOUT = 100 mVP-P Slew Rate SR — 10 — V/µs G = +1
Noise
Input Noise Voltage Eni — 20 — µVP-P f = 0.1 Hz to 10 Hz Input Noise Voltage Density eni — 13 — nV/Hz f = 1 MHz Input Noise Current Density ini 4 — fA/Hz f = 1 kHz DS20002188D-page 4  2009-2014 Microchip Technology Inc. Document Outline 20 MHz, 200 µV Op Amps with mCal Features Typical Applications Design Aids Description Typical Application Circuit High Gain-Bandwidth Op Amp Portfolio Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Digital Electrical Specifications TABLE 1-4: Temperature Specifications 1.3 Timing Diagram FIGURE 1-1: Timing Diagram. 1.4 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves 2.1 DC Signal Inputs FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage Repeatability (repeated calibration). FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Low Input Common Mode Voltage Headroom vs. Ambient Temperature. FIGURE 2-7: High Input Common Mode Voltage Headroom vs. Ambient Temperature. FIGURE 2-8: Input Offset Voltage vs. Common Mode Voltage with VDD = 2.5V. FIGURE 2-9: Input Offset Voltage vs. Common Mode Voltage with VDD = 5.5V. FIGURE 2-10: CMRR and PSRR vs. Ambient Temperature. FIGURE 2-11: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-12: Input Bias and Offset Currents vs. Ambient Temperature with VDD = +5.5V. FIGURE 2-13: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +85°C. FIGURE 2-14: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +125°C. FIGURE 2-15: Input Bias Current vs. Input Voltage (below VSS). 2.2 Other DC Voltages and Currents FIGURE 2-16: Ratio of Output Voltage Headroom to Output Current. FIGURE 2-17: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-18: Output Short-Circuit Current vs. Power Supply Voltage. FIGURE 2-19: Supply Current vs. Power Supply Voltage. FIGURE 2-20: Supply Current vs. Common Mode Input Voltage. FIGURE 2-21: Power-On Reset Voltages vs. Ambient Temperature. FIGURE 2-22: Normalized Internal Calibration Voltage. FIGURE 2-23: VCAL Input Resistance vs. Temperature. 2.3 Frequency Response FIGURE 2-24: CMRR and PSRR vs. Frequency. FIGURE 2-25: Open-Loop Gain vs. Frequency. FIGURE 2-26: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-27: Gain Bandwidth Product and Phase Margin vs. Common Mode Input Voltage. FIGURE 2-28: Gain Bandwidth Product and Phase Margin vs. Output Voltage. FIGURE 2-29: Closed-Loop Output Impedance vs. Frequency. FIGURE 2-30: Gain Peaking vs. Normalized Capacitive Load. FIGURE 2-31: Channel-to-Channel Separation vs. Frequency. 2.4 Input Noise and Distortion FIGURE 2-32: Input Noise Voltage Density vs. Frequency. FIGURE 2-33: Input Noise Voltage Density vs. Input Common Mode Voltage with f = 100 Hz. FIGURE 2-34: Input Noise Voltage Density vs. Input Common Mode Voltage with f = 1 MHz. FIGURE 2-35: Input Noise plus Offset vs. Time with 0.1 Hz Filter. FIGURE 2-36: THD+N vs. Frequency. 2.5 Time Response FIGURE 2-37: Non-Inverting Small Signal Step Response. FIGURE 2-38: Non-Inverting Large Signal Step Response. FIGURE 2-39: Inverting Small Signal Step Response. FIGURE 2-40: Inverting Large Signal Step Response. FIGURE 2-41: The MCP621/1S/2/3/4/5/9 Family Shows No Input Phase Reversal with Overdrive. FIGURE 2-42: Slew Rate vs. Ambient Temperature. FIGURE 2-43: Maximum Output Voltage Swing vs. Frequency. 2.6 Calibration and Chip Select Response FIGURE 2-44: CAL/CS Current vs. Power Supply Voltage. FIGURE 2-45: CAL/CS Voltage, Output Voltage and Supply Current (for Side A) vs. Time with VDD = 2.5V. FIGURE 2-46: CAL/CS Voltage, Output Voltage and Supply Current (for Side A) vs. Time with VDD = 5.5V. FIGURE 2-47: CAL/CS Hysteresis vs. Ambient Temperature. FIGURE 2-48: CAL/CS Turn-On Time vs. Ambient Temperature. FIGURE 2-49: CAL/CS’s Pull-Down Resistor (RPD) vs. Ambient Temperature. FIGURE 2-50: Quiescent Current in Shutdown vs. Power Supply Voltage. FIGURE 2-51: Output Leakage Current vs. Output Voltage. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Calibration Common Mode Voltage Input 3.5 Calibrate/Chip Select Digital Input 3.6 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Calibration and Chip Select FIGURE 4-1: Common-Mode Reference’s Input Circuitry. FIGURE 4-2: Setting VCM with External Resistors. 4.2 Input FIGURE 4-3: Simplified Analog Input ESD Structures. FIGURE 4-4: Protecting the Analog Inputs. FIGURE 4-5: Unity Gain Voltage Limitations for Linear Operation. 4.3 Rail-to-Rail Output FIGURE 4-6: Output Current. FIGURE 4-7: Diagram for Resistive Load Power Calculations. FIGURE 4-8: Diagram for Capacitive Load Power Calculations. 4.4 Improving Stability FIGURE 4-9: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-10: Recommended RISO Values for Capacitive Loads. FIGURE 4-11: Amplifier with Parasitic Capacitance. FIGURE 4-12: Maximum Recommended RF vs. Gain. 4.5 Power Supply 4.6 High Speed PCB Layout 4.7 Typical Applications FIGURE 4-13: Power Driver. FIGURE 4-14: Transimpedance Amplifier for an Optical Detector. FIGURE 4-15: H-Bridge Driver. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service