LND015-Lead SOT-23 Package Outline (K1) 2.90x1.60mm body, 1.45mm height (max), 0.95mm pitch D θ1 e1 5 E1 E Gauge Note 1 L2 (Index Area Plane D/2 x E1/2) 1 e L Seating b θ Plane L1 Top ViewView B View B A A A2 Seating Plane A1 Side View A View A - A Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU a printed indicator. SymbolAA1A2bDEE1ee1LL1L2șș MIN 0.90* 0.00 0.90 0.30 2.75* 2.60* 1.45* 0.30 0O 5O Dimension 0.95 1.90 0.60 0.25 NOM - - 1.15 - 2.90 2.80 1.60 0.45 4O 10O (mm) BSC BSC REF BSC MAX 1.45 0.15 1.30 0.50 3.05* 3.00* 1.75* 0.60 8O 15O JEDEC Registration MO-178, Variation AA, Issue C, Feb. 2000. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ Drawings not to scale. 2017 Microchip Technology Inc. DS20005696A-page 7 Document Outline 1.0 Electrical Characteristics 2.0 Pin Description TABLE 2-1: Pin Function Table 3.0 Functional Description FIGURE 3-1: Switching Waveforms and Test Circuit. TABLE 3-1: Product Summary 4.0 Packaging Information 4.1 Package Marking Information