Datasheet ADXL313 (Analog Devices) - 4

Data Sheet ADXL313 SPECIFICATIONS
TA = −40°C to +105°C, VS = VDD I/O = 3.3 V, acceleration = 0 g, unless otherwise noted.
Table 1. Parameter1 Test Conditions/Comments Min Typ Max Unit
SENSOR INPUT Each axis Measurement Range User selectable ±0.5, ±1, ±2, ±4 g Nonlinearity Percentage of full scale ±0.5 % Micro-Nonlinearity Measured over any 50 mg interval ±2 % Interaxis Alignment Error ±0.1 Degrees Cross-Axis Sensitivity2 ±1 % OUTPUT RESOLUTION Each axis All g Ranges Default resolution 10 Bits ±0.5 g Range Full resolution enabled 10 Bits ±1 g Range Full resolution enabled 11 Bits ±2 g Range Full resolution enabled 12 Bits ±4 g Range Full resolution enabled 13 Bits SENSITIVITY Each axis Sensitivity at XOUT, YOUT, ZOUT Any g-range, full resolution mode 1024 LSB/g ±0.5 g, 10-bit or full resolution 921 1024 1126 LSB/g ±1 g, 10-bit resolution 460 512 563 LSB/g ±2 g, 10-bit resolution 230 256 282 LSB/g ±4 g, 10-bit resolution 115 128 141 LSB/g Sensitivity Change Due to Temperature ±0.01 %/°C 0 g BIAS LEVEL Each axis Initial 0 g Output T = 25°C, XOUT, YOUT ±50 mg T = 25°C, ZOUT ±75 mg 0 g Output Drift over Temperature −40°C < T < +105°C, XOUT, YOUT, referenced to initial 0 g output −125 +125 mg −40°C < T < +105°C, ZOUT, referenced to initial 0 g output −200 +200 mg 0 g Offset Tempco XOUT, YOUT ±0.5 mg/°C ZOUT ±0.75 mg/°C NOISE PERFORMANCE Noise Density X-, Y-axes 150 µg/√Hz Z-axis 250 µg/√Hz RMS Noise X-, Y-axes, 100 Hz output data rate (ODR) 1.5 mg rms Z-axis, 100 Hz ODR 2.5 mg rms OUTPUT DATA RATE/BANDWIDTH User selectable Measurement Rate3 6.25 3200 Hz SELF TEST4 Data rate ≥ 100 Hz, 2.0 V ≤ VS ≤ 3.6 V Output Change in X-Axis 0.20 2.36 g Output Change in Y-Axis −2.36 −0.20 g Output Change in Z-Axis 0.30 3.70 g POWER SUPPLY Operating Voltage Range (VS) 2.0 3.6 V Interface Voltage Range (VDD I/O) 1.7 VS V Supply Current Data rate > 100 Hz 100 170 300 µA Data rate < 10 Hz 30 55 110 µA Standby Mode Leakage Current 0.1 2 µA Turn-On (Wake-Up) Time5 1.4 ms TEMPERATURE Operating Temperature Range −40 +105 °C 1 All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. 2 Cross-axis sensitivity is defined as coupling between any two axes. 3 Bandwidth is half the output data rate. 4 Self test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register, Address 0x31) minus the output (g) when the SELF_TEST bit = 0 (in the DATA_FORMAT register). Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self test, where τ = 1/(data rate). 5 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate). Rev. B | Page 3 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION POWER SEQUENCING POWER SAVINGS Power Modes Autosleep Mode Standby Mode SERIAL COMMUNICATIONS SPI I2C INTERRUPTS DATA_READY Activity Inactivity Watermark Overrun FIFO Bypass Mode FIFO Mode Stream Mode Trigger Mode Retrieving Data from FIFO SELF TEST REGISTER MAP REGISTER DEFINITIONS Register 0x00—DEVID_0 (Read Only) Register 0x01—DEVID_1 (Read Only) Register 0x02—PARTID (Read Only) Register 0x03—REVID (Read Only) Register 0x04—XID (Read Only) Register 0x18—SOFT_RESET (Read/Write) Register 0x1E—OFSX (Read/Write), Register 0x1F—OFSY (Read/Write),Register 0x20—OFSZ (Read/Write) Register 0x24—THRESH_ACT (Read/Write) Register 0x25—THRESH_INACT (Read/Write) Register 0x26—TIME_INACT (Read/Write) Register 0x27—ACT_INACT_CTL (Read/Write) ACT_AC/DC and INACT_AC/DC Bits ACT_x and INACT_x Bits Register 0x2C—BW_RATE (Read/Write) LOW_POWER Bit Rate Bits Register 0x2D—POWER_CTL (Read/Write) I2C_Disable Bit Link Bit AUTO_SLEEP Bit Measure Bit Sleep Bit Wake-Up Bits Register 0x2E—INT_ENABLE (Read/Write) Register 0x2F—INT_MAP (Read/Write) Register 0x30—INT_SOURCE (Read Only) Register 0x31—DATA_FORMAT (Read/Write) SELF_TEST Bit SPI Bit INT_INVERT Bit FULL_RES Bit Justify Bit Range Bits Register 0x32 and Register 0x33—DATA_X0, DATA_X1 (Read Only), Register 0x34 and Register 0x35—DATA_Y0, DATA_Y1 (Read Only), Register 0x36 and Register 0x37—DATA_Z0, DATA_Z1 (Read Only) Register 0x38—FIFO_CTL (Read/Write) FIFO_MODE Bits Trigger Bit Samples Bits 0x39—FIFO_STATUS (Read Only) FIFO_TRIG Bit Entries Bits APPLICATIONS INFORMATION POWER SUPPLY DECOUPLING MECHANICAL CONSIDERATIONS FOR MOUNTING THRESHOLD LINK MODE SLEEP MODE vs. LOW POWER MODE USING SELF TEST 3200 Hz AND 1600 Hz ODR DATA FORMATTING AXES OF ACCELERATION SENSITIVITY SOLDER PROFILE OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS