Datasheet ADXL313 (Analog Devices) - 5

ManufacturerAnalog Devices
Description3-Axis, ±0.5 g/±1 g/±2 g/±4 g Digital Accelerometer
Pages / Page29 / 5 — ADXL313. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL …
RevisionC
File Format / SizePDF / 655 Kb
Document LanguageEnglish

ADXL313. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance

ADXL313 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2 THERMAL RESISTANCE Parameter Rating Table 3 Thermal Resistance

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ADXL313 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Acceleration soldered in a circuit board for surface-mount packages. Any Axis, Unpowered 10,000 g Any Axis, Powered 10,000 g
Table 3. Thermal Resistance
V
Package Type θ
S −0.3 V to +3.9 V
JA θJC Unit
V 32-Lead LFCSP Package 27.27 30 °C/W DD I/O −0.3 V to +3.9 V All Other Pins −0.3 V to VDD I/O + 0.3 V or 3.9 V, whichever is less
ESD CAUTION
Output Short-Circuit Duration Indefinite (Any Pin to Ground) Temperature Range Powered −40°C to +125°C Storage −40°C to +125°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION POWER SEQUENCING POWER SAVINGS Power Modes Autosleep Mode Standby Mode SERIAL COMMUNICATIONS SPI I2C INTERRUPTS DATA_READY Activity Inactivity Watermark Overrun FIFO Bypass Mode FIFO Mode Stream Mode Trigger Mode Retrieving Data from FIFO SELF TEST REGISTER MAP REGISTER DEFINITIONS Register 0x00—DEVID_0 (Read Only) Register 0x01—DEVID_1 (Read Only) Register 0x02—PARTID (Read Only) Register 0x03—REVID (Read Only) Register 0x04—XID (Read Only) Register 0x18—SOFT_RESET (Read/Write) Register 0x1E—OFSX (Read/Write), Register 0x1F—OFSY (Read/Write),Register 0x20—OFSZ (Read/Write) Register 0x24—THRESH_ACT (Read/Write) Register 0x25—THRESH_INACT (Read/Write) Register 0x26—TIME_INACT (Read/Write) Register 0x27—ACT_INACT_CTL (Read/Write) ACT_AC/DC and INACT_AC/DC Bits ACT_x and INACT_x Bits Register 0x2C—BW_RATE (Read/Write) LOW_POWER Bit Rate Bits Register 0x2D—POWER_CTL (Read/Write) I2C_Disable Bit Link Bit AUTO_SLEEP Bit Measure Bit Sleep Bit Wake-Up Bits Register 0x2E—INT_ENABLE (Read/Write) Register 0x2F—INT_MAP (Read/Write) Register 0x30—INT_SOURCE (Read Only) Register 0x31—DATA_FORMAT (Read/Write) SELF_TEST Bit SPI Bit INT_INVERT Bit FULL_RES Bit Justify Bit Range Bits Register 0x32 and Register 0x33—DATA_X0, DATA_X1 (Read Only), Register 0x34 and Register 0x35—DATA_Y0, DATA_Y1 (Read Only), Register 0x36 and Register 0x37—DATA_Z0, DATA_Z1 (Read Only) Register 0x38—FIFO_CTL (Read/Write) FIFO_MODE Bits Trigger Bit Samples Bits 0x39—FIFO_STATUS (Read Only) FIFO_TRIG Bit Entries Bits APPLICATIONS INFORMATION POWER SUPPLY DECOUPLING MECHANICAL CONSIDERATIONS FOR MOUNTING THRESHOLD LINK MODE SLEEP MODE vs. LOW POWER MODE USING SELF TEST 3200 Hz AND 1600 Hz ODR DATA FORMATTING AXES OF ACCELERATION SENSITIVITY SOLDER PROFILE OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS