Datasheet AD7740 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 3 V/5 V Low Power, Synchronous Voltage-to-Frequency Converter |
| Pages / Page | 13 / 4 — AD7740. TIMING CHARACTERISTICS1, 2, 3 (VDD = 3.0 V to 3.6 V, 4.75 V to … |
| Revision | C |
| File Format / Size | PDF / 330 Kb |
| Document Language | English |
AD7740. TIMING CHARACTERISTICS1, 2, 3 (VDD = 3.0 V to 3.6 V, 4.75 V to 5.25 V, GND = O V, REFIN = 2.5 V)
Model Line for this Datasheet
Text Version of Document
AD7740 TIMING CHARACTERISTICS1, 2, 3 (VDD = 3.0 V to 3.6 V, 4.75 V to 5.25 V, GND = O V, REFIN = 2.5 V) Limit at TMIN, TMAX Limit at TMIN, TMAX Parameter VDD = 3.0 V to 3.6 V VDD = 4.75 V to 5.25 V Unit Conditions/Comments
fCLKIN 32 32 kHz min Clock Frequency 1 1 MHz max tHIGH:tLOW 40:60 40:60 min Clock Mark/Space Ratio 60:40 60:40 max t1 50 35 ns typ CLKIN Edge to FOUT Edge Delay t2 2.3 1.8 ns typ FOUT Rise Time t3 1.6 1.4 ns typ FOUT Fall Time t4 tHIGH ± 20 tHIGH ± 8 ns typ FOUT Pulsewidth NOTES 1Guaranteed by design and characterization, not production tested. 2All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (V IL + VIH)/2. 3See Figure 1. Specifications subject to change without notice.
tHIGH CLKIN t4 tLOW FOUT t1 t t 2 3
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS*
MSOP Package (TA = 25°C unless otherwise noted) Power Dissipation . (TJ Max – TA)/θJA VDD to GND . –0.3 V to +7 V θJA Thermal Impedance . 206°C/W Analog Input Voltage to GND . –0.3 V to V θ DD + 0.3 V JC Thermal Impedance . 44°C/W Reference Input Voltage to GND . –0.3 V to V Lead Temperature (10 secs) . 300°C DD + 0.3 V Logic Input Voltage to GND . –0.3 V to VDD + 0.3 V Reflow Soldering FOUT Voltage to GND . –0.3 V to VDD + 0.3 V Peak Temperature . 220 +5/0°C Operating Temperature Range Time at Peak Temperature . 10 sec to 40 sec Commercial (K Version) . 0°C to +85°C *Stresses above those listed under Absolute Maximum Ratings may cause perma- Automotive (Y Version) . –40°C to +105°C nent damage to the device. This is a stress rating only; functional operation of the Storage Temperature Range . –65°C to +150°C device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating Junction Temperature (TJ Max) . 150°C conditions for extended periods may affect device reliability. SOT-23 Package Power Dissipation . (TJ Max – TA)/θJA θJA Thermal Impedance . 240°C/W Lead Temperature (10 secs) . 300°C Reflow Soldering Peak Temperature . 220 + 5/0°C Time at Peak Temperature . 10 sec to 40 sec
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD7740 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
ESD SENSITIVE DEVICE
recommended to avoid performance degradation or loss of functionality. REV. C – 3 –
fCLKIN 32 32 kHz min Clock Frequency 1 1 MHz max tHIGH:tLOW 40:60 40:60 min Clock Mark/Space Ratio 60:40 60:40 max t1 50 35 ns typ CLKIN Edge to FOUT Edge Delay t2 2.3 1.8 ns typ FOUT Rise Time t3 1.6 1.4 ns typ FOUT Fall Time t4 tHIGH ± 20 tHIGH ± 8 ns typ FOUT Pulsewidth NOTES 1Guaranteed by design and characterization, not production tested. 2All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (V IL + VIH)/2. 3See Figure 1. Specifications subject to change without notice.
tHIGH CLKIN t4 tLOW FOUT t1 t t 2 3
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS*
MSOP Package (TA = 25°C unless otherwise noted) Power Dissipation . (TJ Max – TA)/θJA VDD to GND . –0.3 V to +7 V θJA Thermal Impedance . 206°C/W Analog Input Voltage to GND . –0.3 V to V θ DD + 0.3 V JC Thermal Impedance . 44°C/W Reference Input Voltage to GND . –0.3 V to V Lead Temperature (10 secs) . 300°C DD + 0.3 V Logic Input Voltage to GND . –0.3 V to VDD + 0.3 V Reflow Soldering FOUT Voltage to GND . –0.3 V to VDD + 0.3 V Peak Temperature . 220 +5/0°C Operating Temperature Range Time at Peak Temperature . 10 sec to 40 sec Commercial (K Version) . 0°C to +85°C *Stresses above those listed under Absolute Maximum Ratings may cause perma- Automotive (Y Version) . –40°C to +105°C nent damage to the device. This is a stress rating only; functional operation of the Storage Temperature Range . –65°C to +150°C device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating Junction Temperature (TJ Max) . 150°C conditions for extended periods may affect device reliability. SOT-23 Package Power Dissipation . (TJ Max – TA)/θJA θJA Thermal Impedance . 240°C/W Lead Temperature (10 secs) . 300°C Reflow Soldering Peak Temperature . 220 + 5/0°C Time at Peak Temperature . 10 sec to 40 sec
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD7740 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
ESD SENSITIVE DEVICE
recommended to avoid performance degradation or loss of functionality. REV. C – 3 –
