Datasheet ADXRS810 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | High Performance, SPI Digital Output, Angular Rate Sensor |
| Pages / Page | 29 / 6 — Data Sheet. ADXRS810. ABSOLUTE MAXIMUM RATINGS. Table 2. RATE SENSITIVE … |
| File Format / Size | PDF / 677 Kb |
| Document Language | English |
Data Sheet. ADXRS810. ABSOLUTE MAXIMUM RATINGS. Table 2. RATE SENSITIVE AXIS. Parameter Rating. RATE. AXIS. SOIC PACKAGE. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
Data Sheet ADXRS810 ABSOLUTE MAXIMUM RATINGS Table 2. RATE SENSITIVE AXIS Parameter Rating
The ADXRS810 is available in a SOIC package. The device Acceleration (Any Axis, Unpowered, 2000 g 0.5 ms) transmits a positive-going LSB count for clockwise rotation Acceleration (Any Axis, Powered, 0.5 ms) 2000 g about the axis normal to the package top. Conversely, a Supply Voltage (P negative-going LSB count is transmitted for counterclockwise DD) –0.3 V to +6.0 V Output Short-Circuit Duration (Any Pin to Indefinite rotation about the Z-axis. Common)
RATE AXIS
Operating Temperature Range −40°C to +125°C Storage Temperature −40°C to +150°C
+
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
16
rating only; functional operation of the device at these or any 02 other conditions above those indicated in the operational
9
0
SOIC PACKAGE
034- 1 section of this specification is not implied. Exposure to absolute 1 Figure 2. RATEOUT Signal Increases with Clockwise Rotation maximum rating conditions for extended periods may affect device reliability.
ESD CAUTION THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance Package Type θ JA θJC Unit
16-Lead SOIC 191.5 25 °C/W Rev. 0 | Page 5 of 28 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Thermal Resistance Rate Sensitive Axis ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Continuous Self-Test Applications Information Calibrated Performance Mechanical Considerations for Mounting Application Circuit ADXRS810 Signal Chain Timing SPI Communications Characteristics SPI Communication Protocol—Applications Device Data Latching Command/Response SPI Communication Protocol—Bit Definitions Command/Response Bit Descriptions ADXRS810 Fault Register Bit Definitions CHK Bit Assertion: Recommended Start-Up Routine SPI Rate Data Format ADXRS810 Memory Map Memory Register Definitions 0x00 RATE1, 0x01 RATE0 0x02 TEM1, 0x03 TEM0 0x04 LOCST1, 0x05 LOCST0 0x06 HICST1, 0x07 HICST0 0x08 QUAD1, 0x09 QUAD0 0x0A FAULT1, 0x0B FAULT0 0x0C PID1, 0x0D PID0 0x0E SN3, 0x0F SN2, 0x10 SN1, 0x11 SN0 Suggested PCB Layout Solder Profile Package Marking Codes Outline Dimensions Ordering Guide Automotive Products
The ADXRS810 is available in a SOIC package. The device Acceleration (Any Axis, Unpowered, 2000 g 0.5 ms) transmits a positive-going LSB count for clockwise rotation Acceleration (Any Axis, Powered, 0.5 ms) 2000 g about the axis normal to the package top. Conversely, a Supply Voltage (P negative-going LSB count is transmitted for counterclockwise DD) –0.3 V to +6.0 V Output Short-Circuit Duration (Any Pin to Indefinite rotation about the Z-axis. Common)
RATE AXIS
Operating Temperature Range −40°C to +125°C Storage Temperature −40°C to +150°C
+
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
16
rating only; functional operation of the device at these or any 02 other conditions above those indicated in the operational
9
0
SOIC PACKAGE
034- 1 section of this specification is not implied. Exposure to absolute 1 Figure 2. RATEOUT Signal Increases with Clockwise Rotation maximum rating conditions for extended periods may affect device reliability.
ESD CAUTION THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance Package Type θ JA θJC Unit
16-Lead SOIC 191.5 25 °C/W Rev. 0 | Page 5 of 28 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Thermal Resistance Rate Sensitive Axis ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Continuous Self-Test Applications Information Calibrated Performance Mechanical Considerations for Mounting Application Circuit ADXRS810 Signal Chain Timing SPI Communications Characteristics SPI Communication Protocol—Applications Device Data Latching Command/Response SPI Communication Protocol—Bit Definitions Command/Response Bit Descriptions ADXRS810 Fault Register Bit Definitions CHK Bit Assertion: Recommended Start-Up Routine SPI Rate Data Format ADXRS810 Memory Map Memory Register Definitions 0x00 RATE1, 0x01 RATE0 0x02 TEM1, 0x03 TEM0 0x04 LOCST1, 0x05 LOCST0 0x06 HICST1, 0x07 HICST0 0x08 QUAD1, 0x09 QUAD0 0x0A FAULT1, 0x0B FAULT0 0x0C PID1, 0x0D PID0 0x0E SN3, 0x0F SN2, 0x10 SN1, 0x11 SN0 Suggested PCB Layout Solder Profile Package Marking Codes Outline Dimensions Ordering Guide Automotive Products
