Data SheetAD8629-EPABSOLUTE MAXIMUM RATINGS Table 3.THERMAL CHARACTERISTICSParameterRating θJA is specified for worst-case conditions, that is, θJA is specified Supply Voltage 6 V for the device soldered in a circuit board for surface-mount Input Voltage GND − 0.3 V to VS + 0.3 V packages. This was measured using a standard two-layer board. Differential Input Voltage1 ±5.0 V Output Short-Circuit Duration to GND Indefinite Table 4. Storage Temperature Range −65°C to +150°C Package TypeθJAθJCUnit Operating Temperature Range −55°C to +125°C 8-Lead SOIC_N (R-8) 158 43 °C/W Junction Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C ESD CAUTION ESD HBM 8-Lead SOIC_N ±4000 V FICDM 8-Lead SOIC_N ±1250 V 1 The differential input voltage is limited to ±5 V or the supply voltage, whichever is less. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—VS = 5.0 V ELECTRICAL CHARACTERISTICS—VS = 2.7 V ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE