Datasheet AD8028-KGD-CHIP (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier |
| Pages / Page | 8 / 8 — AD8028-KGD-CHIP. Known Good Die. OUTLINE DIMENSIONS. 1.415. 1.205. TOP … |
| Revision | B |
| File Format / Size | PDF / 182 Kb |
| Document Language | English |
AD8028-KGD-CHIP. Known Good Die. OUTLINE DIMENSIONS. 1.415. 1.205. TOP VIEW. (CIRCUIT SIDE). 2012-. 0.076 × 0.076. 23-. 08-
Model Line for this Datasheet
Text Version of Document
AD8028-KGD-CHIP Known Good Die OUTLINE DIMENSIONS 1.415 10 1 9 1.205 2 8 3 7 4 5 6 A TOP VIEW (CIRCUIT SIDE) 2012- 0.076 × 0.076 23- 08-
Figure 2. 10-Pad Bare Die [CHIP] (C-10-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Typical Die Specifications Parameter Value Unit
Chip Size 1420 × 1290 µm Scribe Line Width 75 µm Die Size 55.7 × 47.4 Mil Thickness 305 µm Bond Pads (Min Size) 76 × 76 µm Bond Pad Composition 1% Copper Doped Aluminum % Backside Si Not Applicable Passivation Doped oxide/SiN Not Applicable ESD HBM 2000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8028-KGD-CHIP –40°C to +125°C 10-Pad Bare Die C-10-3
©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10787-0-11/12(B)
Rev. B | Page 8 of 8 Document Outline Features Applications General Description Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
Figure 2. 10-Pad Bare Die [CHIP] (C-10-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Typical Die Specifications Parameter Value Unit
Chip Size 1420 × 1290 µm Scribe Line Width 75 µm Die Size 55.7 × 47.4 Mil Thickness 305 µm Bond Pads (Min Size) 76 × 76 µm Bond Pad Composition 1% Copper Doped Aluminum % Backside Si Not Applicable Passivation Doped oxide/SiN Not Applicable ESD HBM 2000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8028-KGD-CHIP –40°C to +125°C 10-Pad Bare Die C-10-3
©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10787-0-11/12(B)
Rev. B | Page 8 of 8 Document Outline Features Applications General Description Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
