Datasheet AD822-EP (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | Single-Supply, Rail-to-Rail Low Power FET-Input Op Amp |
| Pages / Page | 20 / 10 — AD822-EP. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 4. … |
| File Format / Size | PDF / 321 Kb |
| Document Language | English |
AD822-EP. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 4. Parameter Rating. Table 5. Thermal Resistance. Package Type. θJA
Model Line for this Datasheet
Text Version of Document
AD822-EP ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 4.
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Supply Voltage ±18 V Internal Power Dissipation
Table 5. Thermal Resistance
8-Lead SOIC_N (R) Observe Maximum
Package Type θJA θJC Unit
Junction Temperature 8-lead SOIC_N (R) 160 43 °C/W Input Voltage ((V+) + 0.2 V) to ((V−) − 20 V) Output Short-Circuit Duration Indefinite
ESD CAUTION
Differential Input Voltage ±30 V Storage Temperature Range (R) –65°C to +150°C Operating Temperature Range −55°C to +125°C Maximum Junction Temperature 150°C Lead Temperature 260°C (Soldering, 60 sec) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 10 of 20 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Supply Voltage ±18 V Internal Power Dissipation
Table 5. Thermal Resistance
8-Lead SOIC_N (R) Observe Maximum
Package Type θJA θJC Unit
Junction Temperature 8-lead SOIC_N (R) 160 43 °C/W Input Voltage ((V+) + 0.2 V) to ((V−) − 20 V) Output Short-Circuit Duration Indefinite
ESD CAUTION
Differential Input Voltage ±30 V Storage Temperature Range (R) –65°C to +150°C Operating Temperature Range −55°C to +125°C Maximum Junction Temperature 150°C Lead Temperature 260°C (Soldering, 60 sec) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 10 of 20 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
