Datasheet HMC500LP3, 500LP3E (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | GaAs HBT Vector Modulator SMT, 1.8 - 2.2 GHz |
| Pages / Page | 8 / 4 — HMC500LP3 / 500LP3E. GaAs HBT VECTOR. MODULATOR 1.8 - 2.2 GHz. Typical … |
| File Format / Size | PDF / 398 Kb |
| Document Language | English |
HMC500LP3 / 500LP3E. GaAs HBT VECTOR. MODULATOR 1.8 - 2.2 GHz. Typical Supply Current vs. Vcc. Absolute Maximum Ratings
Model Line for this Datasheet
Text Version of Document
HMC500LP3 / 500LP3E
v02.1109
GaAs HBT VECTOR MODULATOR 1.8 - 2.2 GHz Typical Supply Current vs. Vcc Absolute Maximum Ratings
Vcc (V) Icc (mA) RF Input (Vcc = +8V) 27 dBm 7.6 85 Supply Voltage (Vcc) +10V 8.0 90 I & Q Input -0.5V to +5.0V 8.4 95 Channel Temperature (Tc) 135 °C Continuous Pdiss (T = 85°C) Note: 1.25 W (Derate 25 mW/°C above 85°C) Modulator will operate over full voltage range shown above. Thermal Resistance (R ) th 40 °C/W (junction to ground paddle) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS 10 T
Outline Drawing
- SM R O T C E - V S R O T A L NOTES: U 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. MOD 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 500 HMC500LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 500 HMC500LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnishe F d obr pr y An i al c o e g ,D d evi e ce lis vie s r beyli, a eve n d t d to p o be acclac urat e o e an r d d releiars ble , p . Hole we a vesr, en c o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ontact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 9P7h8 o - n 25 e: 7 0- 81 3 - 3 2 4 9- 3 F 470 ax: 9 0 • Ord 7 e 8 r o -n25 lin 0- e a 3 t 373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
10 - 37
Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.hi A tt p ipte lic .c ati o o m n Support: Phone: 1-800-ANALOG-D
v02.1109
GaAs HBT VECTOR MODULATOR 1.8 - 2.2 GHz Typical Supply Current vs. Vcc Absolute Maximum Ratings
Vcc (V) Icc (mA) RF Input (Vcc = +8V) 27 dBm 7.6 85 Supply Voltage (Vcc) +10V 8.0 90 I & Q Input -0.5V to +5.0V 8.4 95 Channel Temperature (Tc) 135 °C Continuous Pdiss (T = 85°C) Note: 1.25 W (Derate 25 mW/°C above 85°C) Modulator will operate over full voltage range shown above. Thermal Resistance (R ) th 40 °C/W (junction to ground paddle) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS 10 T
Outline Drawing
- SM R O T C E - V S R O T A L NOTES: U 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. MOD 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 500 HMC500LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 500 HMC500LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnishe F d obr pr y An i al c o e g ,D d evi e ce lis vie s r beyli, a eve n d t d to p o be acclac urat e o e an r d d releiars ble , p . Hole we a vesr, en c o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ontact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 9P7h8 o - n 25 e: 7 0- 81 3 - 3 2 4 9- 3 F 470 ax: 9 0 • Ord 7 e 8 r o -n25 lin 0- e a 3 t 373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
10 - 37
Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.hi A tt p ipte lic .c ati o o m n Support: Phone: 1-800-ANALOG-D
