Datasheet ADR130 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Precision Series Sub-Band Gap Voltage Reference |
| Pages / Page | 16 / 5 — Data Sheet. ADR130. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. … |
| Revision | D |
| File Format / Size | PDF / 629 Kb |
| Document Language | English |
Data Sheet. ADR130. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter. Ratings. Table 4. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
Data Sheet ADR130 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Ratings
θJA is specified for the worst-case conditions, that is, a device VIN to GND 20 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation 40 mW Storage Temperature Range −65°C to +150°C
Table 4. Thermal Resistance
Specified Temperature Range −40°C to +120°C
Package Type θJA θJC Unit
Lead Temperature (Soldering, 60 sec) 300°C 6-Lead TSOT (UJ-6) 186 67 °C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
ESD CAUTION
rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. C | Page 5 of 16 Document Outline Features Applications Pin Configuration General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Terminology Theory of Operation Power Dissipation Considerations Input Capacitor Output Capacitor Application Notes Basic Voltage Reference Connection Stacking Reference ICs for Arbitrary Outputs Precision Current Source Outline Dimensions Ordering Guide
θJA is specified for the worst-case conditions, that is, a device VIN to GND 20 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation 40 mW Storage Temperature Range −65°C to +150°C
Table 4. Thermal Resistance
Specified Temperature Range −40°C to +120°C
Package Type θJA θJC Unit
Lead Temperature (Soldering, 60 sec) 300°C 6-Lead TSOT (UJ-6) 186 67 °C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
ESD CAUTION
rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. C | Page 5 of 16 Document Outline Features Applications Pin Configuration General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Terminology Theory of Operation Power Dissipation Considerations Input Capacitor Output Capacitor Application Notes Basic Voltage Reference Connection Stacking Reference ICs for Arbitrary Outputs Precision Current Source Outline Dimensions Ordering Guide
