ADP2311Data SheetABSOLUTE MAXIMUM RATINGS Table 2.THERMAL RESISTANCEParameterRating θJA is specified for the worst-case conditions, that is, a device PVIN1, PVIN2, EN −0.3 V to +20 V soldered in a circuit board for surface-mount packages. θJA is SW1, SW2 −1 V to +20 V measured using natural convection on a JEDEC 4-layer board BST1, BST2 VSW + 6 V with the exposed pad soldered to the printed circuit board FB1, FB2, WDI, RSTO, VM2, TIMER, −0.3 V to +6 V (PCB) and with thermal vias. POR, PFO, PFI VREG −0.3 V to +6 V Table 3. Thermal Resistance PGNDx to GND −0.3 V to +0.3 V Package TypeθJAθJCUnit Operating Temperature Range −40°C to +125°C 24-Lead LFCSP_WQ 36.8 1.64 °C/W (Junction) Storage Temperature Range −65°C to +150°C ESD CAUTION Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 20 Document Outline Features Applications Typical Application Circuit General Description Revision History Functional Block Diagram Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Control Scheme Precision Enable/Shutdown Internal Regulator (VREG) Bootstrap Circuitry Soft Start Peak Current-Limit and Short-Circuit Protection Power-On Reset (POR) TIMER Pin Configuration Power Fail Comparator Voltage Monitor Comparator (VM2) Watchdog Timer Power-Up and Power-Down Sequence Overvoltage Protection (OVP) Undervoltage Lockout (UVLO) Thermal Shutdown Applications Information Input Capacitor Selection Output Voltage Setting Inductor Selection Output Capacitor Selection Application Circuit Outline Dimensions Ordering Guide