Datasheet ADP2442 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 36 V,1 A, Synchronous, Step-Down, DC-to-DC Regulator with External Clock Synchronization |
| Pages / Page | 36 / 5 — Data Sheet. ADP2442. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revision | B |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
Data Sheet. ADP2442. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
Data Sheet ADP2442 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device VIN to PGND −0.3 V to +40 V soldered in a circuit board for surface-mount packages based on EN to AGND −0.3 V to +40 V a 4-layer standard JEDEC board. SW to PGND −0.3 V to +40 V BST to PGND −0.3 V to +45 V
Table 3. Thermal Resistance
VCC to AGND −0.3 V to +6 V
Package Type θJA θJC Unit
BST to SW −0.3 V to +6 V 12-Lead LFCSP 40 2.4 °C/W FREQ, PGOOD, SYNC/MODE, COMP, −0.3 V to +6 V FB to AGND
ESD CAUTION
PGND to AGND ±0.3 V Operating Junction Temperature −40°C to +125°C Range Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 260°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 36 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL CIRCUIT CONFIGURATION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS EFFICIENCY IN FORCED FIXED FREQUENCY MODE EFFICIENCY IN PULSE SKIP MODE INTERNAL BLOCK DIAGRAM THEORY OF OPERATION CONTROL ARCHITECURE Fixed Frequency Mode Pulse Skip Mode ADJUSTABLE FREQUENCY POWER GOOD MODE OF OPERATION EXTERNAL SYNCHRONIZATION SOFT START UNDERVOLTAGE LOCKOUT PRECISION ENABLE/SHUTDOWN CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTION THERMAL SHUTDOWN APPLICATIONS INFORMATION ADIsimPOWER DESIGN TOOL SELECTING THE OUTPUT VOLTAGE SETTING THE SWITCHING FREQUENCY EXTERNAL COMPONENT SELECTION Input Capacitor Selection Inductor Selection Output Capacitor Selection BOOST CAPACITOR VCC CAPACITOR LOOP COMPENSATION LARGE SIGNAL ANALYSIS OF THE LOOP COMPENSATION DESIGN EXAMPLE CONFIGURATION AND COMPONENTS SELECTION Resistor Divider Switching Frequency Inductor Selection Input Capacitor Selection Output Capacitor Selection Compensation Selection SYSTEM CONFIGURATION TYPICAL APPLICATION CIRCUITS DESIGN EXAMPLE OTHER TYPICAL CIRCUIT CONFIGURATIONS POWER DISSIPATION AND THERMAL CONSIDERATIONS POWER DISSIPATION Inductor Losses Power Switch Conduction Losses Switching Losses Transition Losses THERMAL CONSIDERATIONS EVALUATION BOARD THERMAL PERFORMANCE CIRCUIT BOARD LAYOUT RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device VIN to PGND −0.3 V to +40 V soldered in a circuit board for surface-mount packages based on EN to AGND −0.3 V to +40 V a 4-layer standard JEDEC board. SW to PGND −0.3 V to +40 V BST to PGND −0.3 V to +45 V
Table 3. Thermal Resistance
VCC to AGND −0.3 V to +6 V
Package Type θJA θJC Unit
BST to SW −0.3 V to +6 V 12-Lead LFCSP 40 2.4 °C/W FREQ, PGOOD, SYNC/MODE, COMP, −0.3 V to +6 V FB to AGND
ESD CAUTION
PGND to AGND ±0.3 V Operating Junction Temperature −40°C to +125°C Range Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 260°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 36 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL CIRCUIT CONFIGURATION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS EFFICIENCY IN FORCED FIXED FREQUENCY MODE EFFICIENCY IN PULSE SKIP MODE INTERNAL BLOCK DIAGRAM THEORY OF OPERATION CONTROL ARCHITECURE Fixed Frequency Mode Pulse Skip Mode ADJUSTABLE FREQUENCY POWER GOOD MODE OF OPERATION EXTERNAL SYNCHRONIZATION SOFT START UNDERVOLTAGE LOCKOUT PRECISION ENABLE/SHUTDOWN CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTION THERMAL SHUTDOWN APPLICATIONS INFORMATION ADIsimPOWER DESIGN TOOL SELECTING THE OUTPUT VOLTAGE SETTING THE SWITCHING FREQUENCY EXTERNAL COMPONENT SELECTION Input Capacitor Selection Inductor Selection Output Capacitor Selection BOOST CAPACITOR VCC CAPACITOR LOOP COMPENSATION LARGE SIGNAL ANALYSIS OF THE LOOP COMPENSATION DESIGN EXAMPLE CONFIGURATION AND COMPONENTS SELECTION Resistor Divider Switching Frequency Inductor Selection Input Capacitor Selection Output Capacitor Selection Compensation Selection SYSTEM CONFIGURATION TYPICAL APPLICATION CIRCUITS DESIGN EXAMPLE OTHER TYPICAL CIRCUIT CONFIGURATIONS POWER DISSIPATION AND THERMAL CONSIDERATIONS POWER DISSIPATION Inductor Losses Power Switch Conduction Losses Switching Losses Transition Losses THERMAL CONSIDERATIONS EVALUATION BOARD THERMAL PERFORMANCE CIRCUIT BOARD LAYOUT RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE
