DatasheetPZT3904T1G (ON Semiconductor) - 7

PZT3904T1G PACKAGE DIMENSIONS SOT−223 (TO−261)
CASE 318E−04
D
ISSUE N
b1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH.
4 MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX H E E A
1.50 1.63 1.75 0.060 0.064 0.068
1 2 3 A1
0.02 0.06 0.10 0.001 0.002 0.004
b
0.60 0.75 0.89 0.024 0.030 0.035
b1
2.90 3.06 3.20 0.115 0.121 0.126
c
0.24 0.29 0.35 0.009 0.012 0.014
b D
6.30 6.50 6.70 0.249 0.256 0.263
E
3.30 3.50 3.70 0.130 0.138 0.145
e1 e e
2.20 2.30 2.40 0.087 0.091 0.094
e1
0.85 0.94 1.05 0.033 0.037 0.041
L
0.20 −−− −−− 0.008 −−− −−−
C L1
1.50 1.75 2.00 0.060 0.069 0.078
q H E
6.70 7.00 7.30 0.264 0.276 0.287
A
0
q
° − 10° 0° − 10° 0.08 (0003)
A1
STYLE 1:
L L1
PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR
SOLDERING FOOTPRINT*
3.8 0.15 2.0 0.079 6.3 2.3 2.3 0.248 0.091 0.091 2.0 0.079 1.5 SCALE 6:1 ǒ mm Ǔ 0.059 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
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