Datasheet MAX6627 (Maxim) - 9
| Manufacturer | Maxim |
| Description | Remote ±1°C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface |
| Pages / Page | 10 / 9 — Functional Diagram. Ordering Information. Package Information. PART. … |
| Revision | 7 |
| File Format / Size | PDF / 1.1 Mb |
| Document Language | English |
Functional Diagram. Ordering Information. Package Information. PART. PIN-PACKAGE. TOP MARK. MAX6627. www.maximintegrated.com/packages
Model Line for this Datasheet
Text Version of Document
MAX6627/MAX6628 Remote ±1°C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface
Functional Diagram
VCC DXP SDO 12-BIT + SIGN SPI SCK ADC INTERFACE DXN CS
Ordering Information Package Information PART PIN-PACKAGE TOP MARK
For the latest package outline information and land patterns
MAX6627
MKA#TG16 8 SOT23 AEQD (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status MAX6627MTA+T 8 TDFN-EP* AUT only. Package drawings may show a different suffix character, but
MAX6628
MKA+T 8 SOT23 AAER the drawing pertains to the package regardless of RoHS status. MAX6628MTA+T 8 TDFN-EP* AUU
Note:
All devices are specified over the -55°C to +125°C operating
PACKAGE PACKAGE OUTLINE LAND
temperature range.
TYPE CODE NO. PATTERN NO.
#Denotes a RoHS-compliant device that may include lead(Pb) that is exempt under the RoHS requirements. 8 SOT23 K8FH#4
21-0078 90-0176
+Denotes a lead-free/RoHS-compliant package. T = Tape and reel. 8 TDFN-EP T833+2
21-0137 90-0059
*EP = Exposed pad.
Chip Information
PROCESS: BiCMOS www.maximintegrated.com Maxim Integrated │ 9
Functional Diagram
VCC DXP SDO 12-BIT + SIGN SPI SCK ADC INTERFACE DXN CS
Ordering Information Package Information PART PIN-PACKAGE TOP MARK
For the latest package outline information and land patterns
MAX6627
MKA#TG16 8 SOT23 AEQD (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status MAX6627MTA+T 8 TDFN-EP* AUT only. Package drawings may show a different suffix character, but
MAX6628
MKA+T 8 SOT23 AAER the drawing pertains to the package regardless of RoHS status. MAX6628MTA+T 8 TDFN-EP* AUU
Note:
All devices are specified over the -55°C to +125°C operating
PACKAGE PACKAGE OUTLINE LAND
temperature range.
TYPE CODE NO. PATTERN NO.
#Denotes a RoHS-compliant device that may include lead(Pb) that is exempt under the RoHS requirements. 8 SOT23 K8FH#4
21-0078 90-0176
+Denotes a lead-free/RoHS-compliant package. T = Tape and reel. 8 TDFN-EP T833+2
21-0137 90-0059
*EP = Exposed pad.
Chip Information
PROCESS: BiCMOS www.maximintegrated.com Maxim Integrated │ 9
