link to page 11 link to page 10 HMC788AData SheetAPPLICATIONS INFORMATION EVALUATION PCBTable 5. List of Materials for the Evaluation PCB The PCB used in this application must use RF circuit design EV1HMC788ALP21 techniques. Signal lines must have 50 Ω impedance while the ItemDescription package ground leads and exposed pad must be connected J1 to J2 PCB mount Subminiature Version A (SMA) connector directly to the ground plane similar to that shown in Figure 19. J5, J6 DC pin A sufficient number of via holes must be used to connect the top C1, C2 0.01 μF capacitor, 0502 package and bottom ground planes. The EV1HMC788ALP2 evaluation C3 100 pF capacitor, 0402 package board must be mounted to an appropriate heat sink. C4 2.2 μF Case A package R1 0 Ω resistor, 0402 package Figure 18 shows the schematic of the EV1HMC788ALP2 L1 Inductor, conical 6.35 μH evaluation board. The board is powered by a single supply between U1 HMC788ALP2E 4.5 V and 5.5 V and is decoupled by a 2.2 µF capacitor and a 100 pF PCB2 129549 evaluation PCB capacitor. DC blocking capacitors are instal ed at the RFIN and 1 Reference this number when ordering the complete evaluation PCB. RFOUT ports. Note that inductor L1 is a required component to 2 The circuit board material is Rogers 4350. apply the VCC = 5 V bias to the RFOUT pin. VCCC3C4100pF2.2µFL1 6.35µHC1C2.01µF.01µFRFINRFOUTPIN 2PIN 5PIN 3PACKAGE BOTTOM 018 MUST BE CONNECTED TO RF GROUND. 16204- Figure 18. Evaluation Board Schematic Rev. C | Page 10 of 12 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Basic Connections Applications Information Evaluation PCB Outline Dimensions Ordering Guide