Datasheet HMC311SC70, 311SC70E (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8 GHz |
| Pages / Page | 6 / 4 — HMC311SC70 / 311SC70E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 8 GHz. … |
| File Format / Size | PDF / 962 Kb |
| Document Language | English |
HMC311SC70 / 311SC70E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 8 GHz. Absolute Maximum Ratings. Outline Drawing
Model Line for this Datasheet
Text Version of Document
HMC311SC70 / 311SC70E
v05.0517
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +7V RF Input Power (RFIN)(Vcc = +3.9V) +10 dBm ELECTROSTATIC SENSITIVE DEVICE T Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS M Continuous Pdiss (T = 85 °C) 0.34 W (derate 5.21 mW/°C above 85 °C) Thermal Resistance 191 °C/W (junction to lead) S - S Storage Temperature -65 to +150 °C R Operating Temperature -40 to +85 °C IE Class1A, ESD Sensitivity (HBM) Passed 250V LIF P
Outline Drawing
M K A C LO IN B A R & G E IV R NOTES: D 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD MATERIAL: COPPER ALLOY 3. LEAD PLATING: Sn/Pb 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking HMC311SC70 Low Stress Injection Molded Plastic Sn/Pb MSL1 [1] 311 HMC311SC70E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 311E [1] Max peak reflow temperature of 235°C [2] Max peak reflow temperature of 260°C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Typical Performance Characteristics Broadband Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Reverse Isolation vs. Temperature Noise Figure vs. Temperature P1dB vs. Temperature Psat vs. Temperature Power Compression @ 1 GHz Power Compression @ 6 GHz Output IP3 vs. Temperature Gain, Power, IP3 & Supply Current vs. Supply Voltage @ 1 GHz Absolute Maximum Ratings Outline Drawing Package Information Pin Descriptions Application Circuit Recommended Component Values Evaluation PCB List of Materials for Evaluation PCB
v05.0517
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +7V RF Input Power (RFIN)(Vcc = +3.9V) +10 dBm ELECTROSTATIC SENSITIVE DEVICE T Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS M Continuous Pdiss (T = 85 °C) 0.34 W (derate 5.21 mW/°C above 85 °C) Thermal Resistance 191 °C/W (junction to lead) S - S Storage Temperature -65 to +150 °C R Operating Temperature -40 to +85 °C IE Class1A, ESD Sensitivity (HBM) Passed 250V LIF P
Outline Drawing
M K A C LO IN B A R & G E IV R NOTES: D 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD MATERIAL: COPPER ALLOY 3. LEAD PLATING: Sn/Pb 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking HMC311SC70 Low Stress Injection Molded Plastic Sn/Pb MSL1 [1] 311 HMC311SC70E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 311E [1] Max peak reflow temperature of 235°C [2] Max peak reflow temperature of 260°C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Typical Performance Characteristics Broadband Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Reverse Isolation vs. Temperature Noise Figure vs. Temperature P1dB vs. Temperature Psat vs. Temperature Power Compression @ 1 GHz Power Compression @ 6 GHz Output IP3 vs. Temperature Gain, Power, IP3 & Supply Current vs. Supply Voltage @ 1 GHz Absolute Maximum Ratings Outline Drawing Package Information Pin Descriptions Application Circuit Recommended Component Values Evaluation PCB List of Materials for Evaluation PCB
