Datasheet AD4003-KGD (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | 18-Bit, 2 MSPS, Easy Drive, Differential SAR ADC |
| Pages / Page | 9 / 9 — Known Good Die. AD4003-KGD. OUTLINE DIMENSIONS. 1.695. 0.41. 2.285. TOP … |
| File Format / Size | PDF / 240 Kb |
| Document Language | English |
Known Good Die. AD4003-KGD. OUTLINE DIMENSIONS. 1.695. 0.41. 2.285. TOP VIEW. SIDE VIEW. 0.08 × 0.08. 2018-. 23-. 01-
Model Line for this Datasheet
Text Version of Document
Known Good Die AD4003-KGD OUTLINE DIMENSIONS 1.695 0.41 1 15 2 14 3 4 5 2.285 13 6 12 7 8 9 11 10 A TOP VIEW SIDE VIEW 0.08 × 0.08 2018- 23- 01-
Figure 4. 15-Pad Bare Die [CHIP] (C-15-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 7. Die Specifications Parameter Value Unit
Chip Size 1695 × 2205 µm Scribe Line Width 80 × 80 µm Die Size 1695 × 2285 µm maximum Thickness 410 µm Bond Pad 70 × 70 µm maximum Bond Pad Composition AlCu (0.5%) % Backside Standard assembly die attach N/A Passivation Oxynitride N/A
Table 8. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Bond pin five first
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD4003-KGD-WP −40°C to +125°C 15-Pad Bare Die [CHIP] C-15-1
©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16525-0-6/18(0)
Rev. 0 | Page 9 of 9 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Description Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
Figure 4. 15-Pad Bare Die [CHIP] (C-15-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 7. Die Specifications Parameter Value Unit
Chip Size 1695 × 2205 µm Scribe Line Width 80 × 80 µm Die Size 1695 × 2285 µm maximum Thickness 410 µm Bond Pad 70 × 70 µm maximum Bond Pad Composition AlCu (0.5%) % Backside Standard assembly die attach N/A Passivation Oxynitride N/A
Table 8. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Bond pin five first
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD4003-KGD-WP −40°C to +125°C 15-Pad Bare Die [CHIP] C-15-1
©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16525-0-6/18(0)
Rev. 0 | Page 9 of 9 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Description Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
