Datasheet AD9271 (Analog Devices) - 8

ManufacturerAnalog Devices
DescriptionOctal LNA/VGA/AAF/ADC and Crosspoint Switch
Pages / Page60 / 8 — AD9271. SWITCHING SPECIFICATIONS. Table 3. Parameter. Temp Min. Typ. Max. …
RevisionB
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Document LanguageEnglish

AD9271. SWITCHING SPECIFICATIONS. Table 3. Parameter. Temp Min. Typ. Max. Unit

AD9271 SWITCHING SPECIFICATIONS Table 3 Parameter Temp Min Typ Max Unit

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AD9271 SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, CWVDD = 3.3 V, 400 mV p-p differential input, 1.0 V internal ADC reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 3. Parameter
1
Temp Min Typ Max Unit
CLOCK2 Maximum Clock Rate Full 50 MSPS Minimum Clock Rate Full 10 MSPS Clock Pulse Width High (tEH) Full 10.0 ns Clock Pulse Width Low (tEL) Full 10.0 ns OUTPUT PARAMETERS2, 3 Propagation Delay (tPD) Full 1.5 2.3 3.1 ns Rise Time (tR) (20% to 80%) Full 300 ps Fall Time (tF) (20% to 80%) Full 300 ps FCO Propagation Delay (tFCO) Full 1.5 2.3 3.1 ns DCO Propagation Delay (tCPD)4 Full tFCO + ns (tSAMPLE/24) DCO to Data Delay (tDATA)4 Full (tSAMPLE/24) − 300 (tSAMPLE/24) (tSAMPLE/24) + 300 ps DCO to FCO Delay (tFRAME)4 Full (tSAMPLE/24) − 300 (tSAMPLE/24) (tSAMPLE/24) + 300 ps Data-to-Data Skew (tDATA-MAX − tDATA-MIN) Full ±50 ±200 ps Wake-Up Time (Standby), VGAIN = 0.5 V 25°C 1 μs Wake-Up Time (Power-Down) 25°C 1 ms Pipeline Latency Full 8 Clock cycles APERTURE Aperture Uncertainty (Jitter) 25°C <1 ps rms 1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed. 2 Can be adjusted via the SPI interface. 3 Measurements were made using a part soldered to FR-4 material. 4 tSAMPLE/24 is based on the number of bits divided by 2, because the delays are based on half duty cycles. Rev. B | Page 8 of 60 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY PRODUCT HIGHLIGHTS SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS ADC TIMING DIAGRAMS ABSOLUTE MAXIMUM RATINGS THERMAL IMPEDANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS EQUIVALENT CIRCUITS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ULTRASOUND CHANNEL OVERVIEW Low Noise Amplifier (LNA) Active Impedance Matching LNA Noise INPUT OVERDRIVE Input Overload Protection CW DOPPLER OPERATION Crosspoint Switch TGC OPERATION Variable Gain Amplifier Gain Control VGA Noise Antialiasing Filter ADC CLOCK INPUT CONSIDERATIONS Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO Pin SCLK Pin CSB Pin RBIAS Pin Voltage Reference Internal Reference Operation External Reference Operation SERIAL PORT INTERFACE (SPI) HARDWARE INTERFACE MEMORY MAP READING THE MEMORY MAP TABLE RESERVED LOCATIONS DEFAULT VALUES LOGIC LEVELS APPLICATIONS INFORMATION DESIGN GUIDELINES Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations EVALUATION BOARD POWER SUPPLIES INPUT SIGNALS OUTPUT SIGNALS DEFAULT OPERATION AND JUMPER SELECTION SETTINGS QUICK START PROCEDURE SCHEMATICS AND ARTWORK OUTLINE DIMENSIONS ORDERING GUIDE